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ams OSRAM AG's Light Sensors & Photonics unit seeks a Process Integration Representative to advance CMOS/TSV wafer-level processes. You will supervise manufacturing, ensure process deliveries, and drive cross-functional improvements across R&D, QA, and Design.
The role requires a Master’s or PhD in a related field, strong analytical skills, and experience with Six Sigma methodologies. Fluent English is essential, with German a strong advantage.
We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.
We offer competitive salaries and additional benefits based on your performance, experience and qualification.
The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/). We offer a higher compensation depending on your expertise and skills.