Principal RF Photonics Engineer (d/m/f)

Ams Osram; Premstätten; Vor Ort; EUR 120.000 - 150.000; Vollzeit

Zusammenfassung

ams OSRAM's LSP unit seeks a hands-on Principal RF Photonics Engineer to drive lab metrology and PCB design for electro-optical data transmission using PICs. You will design high‑speed PCBs, automate wafer-to-board tests, and collaborate with PIC designers to optimize test structures.

The role requires 10+ years of lab and wafer testing experience, proficiency with VNAs, oscilloscopes, LabVIEW, Python, and Keysight tools, plus strong English and German as a plus.

Qualifikationen

• MS or PhD in Electrical, Optical, or related field.
• 10+ years hands-on lab, wafer-level testing in microwave photonics or high-speed optical comms.
• Experience with wafer probing, calibration, and high-frequency test equipment (VNAs, optical oscilloscopes, BERTs).
• PCB design of high-speed, controlled-impedance boards for RF/optoelectronic apps (Altium/Cadence).
• Automation and scripting in Python and LabVIEW for test benches.
• Experience with Keysight ADS, Cadence, and MATLAB for link simulation.

Aufgaben

• RF & electro-optical characterization of high-speed data links, BER, eye diagrams, jitter, S-parameters.
• Wafer-level metrology and calibration routines for photonic integrated circuits.
• Design and integration of high-speed PCBs with drivers, TIAs, and RF components.
• Analyze and optimize SI/PI to minimize jitter and power issues.
• Develop test automation scripts to control wafer probe stations and data capture.
• Simulate link performance and correlate with measured data using Keysight ADS and MATLAB.
• Collaborate with PIC designers and packaging to optimize test structures.

Kenntnisse

RF photonics

Lab metrology

High-speed PCB design

Signal integrity

Python scripting

LabVIEW

Eye diagrams

BER testing

Ausbildung

MS or PhD in Electrical/Optical Engineering

Tools

Altium

Cadence

Keysight ADS

MATLAB

BERTs

Jobbeschreibung

We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.

We are looking for a hands‑on Principal RF Photonics Engineer (d/m/f) driving lab metrology, and PCB design methodology efforts for electro‑optical data transmission using Photonic Integrated Circuits (PICs). If you enjoy designing high‑speed printed circuit boards, automating complex test setups from wafer to board level, we would love to connect with you.

Tasks and responsibilities:

• RF & Electro‑Optical Characterization: Evaluate high‑speed electro‑optical data transmission links by measuring Bit Error Rates (BER), eye diagrams, jitter, S‑parameters, and noise performance.
• Wafer‑Level Metrology: Design and execute advanced wafer‑level optical and RF probing procedures, establishing rigorous calibration routines and measurement methodologies for PICs.
• PCB Design & Hardware Integration: Design high‑speed PCBs and custom test boards for electro‑optical interfaces, integrating drivers, TIAs, and RF components with minimal signal loss.
• Signal & Power Integrity: Analyze and optimize signal and power delivery networks for high‑speed photonic systems to minimize jitter, power droop, and electromagnetic interference.
• Test & Measurement Automation: Develop and scale Python‑and/or LabView based automation scripts for efficient and accurate wafer‑level probe station control and data acquisition.
• Simulation & Correlation: Use tools like Keysight ADS and MATLAB to simulate link performance, correlate models with empirical wafer and board data, and resolve bottlenecks.
• Collaboration: Work closely with PIC designers and packaging engineers to optimize test structures, probe footprints, and prototype bring‑up.

• Degree: M.S. or Ph.D. in Electrical Engineering, Applied Physics, Optical Engineering, or a related field
• Experience: 10+ years of hands‑on lab, wafer‑level testing, and engineering experience in microwave photonics or high‑speed optical communications
• Wafer‑Level Probing & Metrology: Strong practical expertise in optical and RF wafer probing, calibration, and high‑frequency test equipment (VNAs, optical oscilloscopes, BERTs, and Lightwave Component Analyzers)
• PCB Design: Demonstrated experience designing high‑speed, controlled‑impedance PCBs for RF and optoelectronic applications (using tools like Altium, Cadence, or equivalent)
• Automation & Scripting: Proficiency in Python and/or LabView for test bench automation and advanced data Analysis
• Signal Analysis: Solid understanding of high‑speed signal integrity, NRZ/PAM4 signaling, and the interpretation of eye diagrams and BER curves
• Simulation Tools: Experience with design and analysis software such as Keysight ADS, Cadence Virtuoso and MATLAB
• PIC Familiarity: Working knowledge of Photonic Integrated Circuits, modulators, photo detectors and emitters
• Languages: Proficiency in English, both written and spoken; German is a plus

We offer competitive salaries and additional benefits based on your performance, experience and qualification.
The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group H (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).
We offer a higher compensation depending on your expertise and skills.