Senior AI Accelerator Package Design Engineer

Evollabs; Dubai; On-site; AED 350,000 - 600,000; Full time

Job summary

Evollabs in Dubai, UAE is seeking a Package Design Engineer to own the chip package for AI accelerators, from die/package/board co-design to first-silicon bring-up. You’ll work across silicon, board, SI/PI, and thermal teams to deliver robust, high-performance packages.

The role demands 8+ years in semiconductor packaging, with hands-on experience in 2.5D interposers, CoWoS, or fan-out techniques, plus proficiency with Cadence APD/SiP Layout and 3DIC tools.

Qualifications

• 8+ years in semiconductor package design.
• Experience with 2.5D interposer, CoWoS, EMIB, InFO/FoCoS.
• Experience with high-speed serial interfaces and D2D links.

Responsibilities

• Package architecture and technology selection across floorplans and bump patterns.
• Multi-chiplet package design for substrates and interposers.
• High-speed interface packaging and channel budgeting.
• Thermal and mechanical co-design for high-power accelerators.
• Manufacturing and supply-chain engagement with foundries/OSAT.
• Package test planning and first-silicon bring-up support.
• Cross-functional documentation and design reviews.

Skills

Semiconductor packaging

High-speed interfaces

Multi-chiplet packaging

Package SI/PI

PDN/thermal design

DFM with OSAT

UCIe/BoW knowledge

Education

Bachelor’s or Master’s in Electrical Engineering

Tools

Cadence APD/SiP Layout

Synopsys 3DIC Compiler

HFSS/SIwave

Clarity/Sigrity

Job description

Evollabs in Dubai, UAE is seeking a Package Design Engineer to own the chip package for AI accelerators, from die/package/board co-design to first-silicon bring-up. You’ll work across silicon, board, SI/PI, and thermal teams to deliver robust, high-performance packages.

The role demands 8+ years in semiconductor packaging, with hands-on experience in 2.5D interposers, CoWoS, or fan-out techniques, plus proficiency with Cadence APD/SiP Layout and 3DIC tools.