XPU Architect

Volantis Semiconductor, Inc.

Boston (MA)

On-site

USD 180,000 - 240,000

Full time

14 days+
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Job summary

Volantis Semiconductor, Inc. is seeking an XPU Architect to own the compute engine architecture for the A-0 and A-1 systems.

The role will adapt existing third-party IP in creative ways to address bandwidth and memory interface challenges, with future generations moving toward semi-custom and custom designs. The ideal candidate has deep experience in high performance ASICs, silicon implementation constraints, and AI workloads with low latency inference.

Qualifications

  • Experience architecting and owning a high performance, high TDP ASIC.
  • Knowledge of computer architecture and silicon implementation constraints.
  • Deep understanding of AI workloads and low latency LLM inference.
  • Understanding of workload and system bottlenecks (inference, interconnect, memory bandwidth/latency).

Skills

ASIC architecture
Silicon implementation
AI workloads
LLM inference
Interconnect bandwidth
HBM architecture
Tapeouts

Tools

Tapeouts
HBM architecture

Job description

What We’re Looking For:

We’re looking for an XPU Architect to own the XPU compute engine architecture of the A-0 and A-1 systems. This will initially involve heavily leveraging existing 3rd party IP, but in a creative way to solve the bandwidth demand challenges and memory system interface challenges. Future generations of the compute XPU will be semi-custom and custom designs.

Ideal Background:

An ideal candidate will have:

  • Previous experience architecting and owning a high performance, high TDP ASIC (eg AI chips, network switch chips, high performance CPUs or similar)
  • Knowledge of both computer architecture but also silicon implementation, and understanding of the realistic constraints that silicon implementation places upon architectural options
  • Deep understanding of AI workloads, especially low latency LLM inference
  • Understanding of workload and system level bottlenecks, especially around inference, as it pertains to interconnect, memory capacity, bandwidth, latency, etc.
Strongly Preferred:
  • Hands-on experience with AI chip architecture and tapeouts
  • End to end ownership of at least one AI ASIC project
  • History of product delivery (regardless of ultimate commercial success of said product)
  • Experience with HBM-based AI chip architecture
  • Experience in proposing “weird” chip architectures (in any domain, not just AI!)
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