Wire Bonding Technician: Auto/Manual in Cleanroom

MACOM; Lowell (MA); On-site; USD 27,552 - 48,216; Full time

Benefits offered by this job

Health, dental, and vision insurance

Employer-sponsored 401(k) plan

Paid time off

Professional development opportunities

Job summary

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. This role focuses on Automatic/Manual wire bonding, operating H+K 820 or F&K Delvotec systems in a clean-room environment, with attention to bond quality and process documentation.

Require a High School diploma and at least 2 years in microelectronics assembly. The job offers an hourly range of $20–$35 and comprehensive benefits; U.S. Persons only per ITAR.

Qualifications

• High School diploma is required.
• Minimum 2 years' experience in microelectronics module assembly.
• Experience with gold wire/ribbon bonding is preferred.

Responsibilities

• Operate and set up Automatic Gold wire/ribbon bonders per layout drawings.
• Ensure proper wire formation, bond appearance and bond strength.
• Maintain MIL-STD 883 compliance and FOD/ESD controls.

Skills

Wire bonding

Bonding equipment setup

SPC data plotting

ESD controls

Education

High School diploma

Tools

H+K 820 systems

F&K Delvotec

Job description

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. This role focuses on Automatic/Manual wire bonding, operating H+K 820 or F&K Delvotec systems in a clean-room environment, with attention to bond quality and process documentation.

Require a High School diploma and at least 2 years in microelectronics assembly. The job offers an hourly range of $20–$35 and comprehensive benefits; U.S. Persons only per ITAR.