Automatic Die Attach Operator

MACOM

Nashua, Northern (NH, KY)

Hybrid

USD 42,000 - 52,000

Full time

3 days ago
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Job summary

MACOM in Nashua, NH is seeking an Automatic Die Attach Operator to assemble microelectronic modules in a clean-room environment. The role focuses on operating and setting up automatic die attach equipment, ensuring precise epoxy dispense and die placement according to micro-circuit layouts.

You will work from production schedules, follow procedures, and document activities to Mil-STD-883. A minimum of two years in microelectronics assembly and a high school diploma are required; training is

Qualifications

  • High School diploma required.
  • Minimum of 2 years' experience in microelectronics module assembly.
  • Ability to learn and operate multiple microelectronics production machines.
  • Attention to detail and compliance with Mil Standard 883.

Responsibilities

  • Operate and set up Datacon 2200 automatic die attach machines per layout drawings.
  • Set up and adjust Plaomar 8000 or HK 820 systems or learn to run other equipment.
  • Work from production schedules and procedures; document activities to standards.
  • Maintain clean-room standards (smocks, gloves) and production records.

Skills

Wire-bonding

Education

High School diploma

Tools

Datacon 2200
Plaomar 8000
H+K 820

Job description

Automatic Die Attach Operator
Job Description

This role will be an assembly operator working with Automatic die attach equipment.

Responsibilities:
  • Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
  • Operate and set-up Automatic epoxy dispensing die attach machines (Datacon 2200 systems) per micro-circuit layout drawing.
  • Involves working to microcircuit layout drawings; Operator is responsible for proper conductive epoxy dispense and die placement.
  • Flexibility to be trained in multiple Microelectronics processes that involve die attaching.
  • Requires significant attention to detail for production activities and documentation to maintain compliance with Mil Standard 883 requirements.
Experience and Education:
  • Ability to set-up, operate and adjust (Plaomar 8000 or H+K 820 systems) or ability to learn to run a variety of microelectronic production equipment.
  • Minimum of 2 years' experience in microelectronics module assembly area.
  • High School diploma required.
Knowledge and Skill Requirements:
  • Wire-bonding one Mil gold (Au) wire to a variety of dice and substrates.
Physical Environment and Working Conditions:
  • Clean-room environment with Smocks and gloves.
EEO:

MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.

Reasonable Accommodation:

MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process, please call +1-978-656-2500 or email HR_Ops@MACOM.com. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.

ITAR

Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

Benefits

This position offers a comprehensive benefits package including but not limited to:

  • Health, dental, and vision insurance.
  • Employer-sponsored 401(k) plan.
  • Paid time off.
  • Professional development opportunities.
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