Wire Bond Process Engineer – Semiconductor Packaging

Doist

San Jose (CA)

On-site

USD 110,000 - 150,000

Full time

14 days+

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Job summary

Lumilens in San Jose, CA is seeking a Wire Bond Manufacturing Engineer specializing in Process & Equipment to join our Manufacturing Engineering team. You will develop, qualify, optimize, and sustain wire bonding processes for semiconductor packaging, driving high yield and reliability across ball, wedge, and ribbon bonds.

You will lead DOE-driven process improvements, own equipment uptime and throughput, collaborate across QA, Design, and Production, and support NPI and CAPA activities in a

Qualifications

  • Bachelor’s degree in Electrical, Mechanical, or Materials Science engineering.
  • 3–7 years of hands-on wire bond process and equipment experience.
  • Experience with ball, wedge, and ribbon bonding and related failures.
  • Familiarity with DOE, SPC, and CAPA methods.
  • Strong analytical, troubleshooting, and cross-functional communication skills.

Responsibilities

  • Develop, qualify, and optimize wire bond processes for multiple wire types.
  • Establish process specs, recipes, and control plans.
  • Lead CAPA and root-cause analysis for yield losses.
  • Support NPI by defining new bond process flows.
  • Own equipment uptime, throughput, and cycle time.
  • Collaborate with QA, Design, and Production teams.
  • Ensure IPC/JEDEC compliance in processes and tests.

Skills

Wire Bonding
DOE
SPC
CAPA
Root Cause Analysis
Cross-functional Communication
Analytical Skills
Shift Support

Education

Bachelor’s degree in Electrical/Mechanical/Materials Science

Tools

ASM
Kulicke & Soffa
Shinkawa
Hesse
West Bond

Job description

Lumilens in San Jose, CA is seeking a Wire Bond Manufacturing Engineer specializing in Process & Equipment to join our Manufacturing Engineering team. You will develop, qualify, optimize, and sustain wire bonding processes for semiconductor packaging, driving high yield and reliability across ball, wedge, and ribbon bonds.

You will lead DOE-driven process improvements, own equipment uptime and throughput, collaborate across QA, Design, and Production, and support NPI and CAPA activities in a

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