Advanced Packaging Dry Etch Module Development Engineer

Intel; Hillsboro (OR); On-site; USD 133,800 - 255,200; Full time

Job summary

Intel in Hillsboro, Oregon is seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The role focuses on developing, optimizing, and implementing dry etch processes for 2.5D/3D integration and chiplet packaging.

You will design experiments (DOE), partner with equipment suppliers, and drive roadmaps to meet future manufacturing needs while improving yield and efficiency.

Qualifications

• Master or PhD in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
• Master's degree with at least 4 years of experience, or PhD with at least 2 years of experience.
• Experience with plasma etch equipment platforms.

Responsibilities

• Develop and optimize plasma etch processes for advanced packaging applications.
• Design experiments (DOE) to characterize process windows and optimize etch performance.
• Develop and execute technology roadmaps to meet future manufacturing needs while pushing industry standards forward.
• Partner with equipment suppliers to design, test, and implement innovative process solutions.
• Monitor and optimize production efficiency, yield, and manufacturing techniques for existing products.
• Identify and implement modifications to improve equipment performance, reduce costs, and enhance production output.
• Collaborate cross-functionally to develop scalable, robust manufacturing solutions aligned with Intel's strategic objectives.

Skills

Process development

DOE

Statistical process control

Cross-functional collaboration

Leadership

Education

Master's degree

PhD

Tools

Plasma etch equipment platforms

Job description

Job Details

Job Description: We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions.

Key Responsibilities

• Develop and optimize plasma etch processes for advanced packaging applications
• Design experiments (DOE) to characterize process windows and optimize etch performance
• Develop and execute technology roadmaps to meet future manufacturing needs while pushing industry standards forward.
• Partner with equipment suppliers to design, test, and implement innovative process solutions.
• Monitor and optimize production efficiency, yield, and manufacturing techniques for existing products
• Identify and implement modifications to improve equipment performance, reduce costs, and enhance production output
• Collaborate cross-functionally to develop scalable, robust manufacturing solutions aligned with Intel's strategic objectives

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• Master or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
• Master's degree with at least 4 years of experience, or PhD with at least 2 years of experience.

Experience listed above should be a combination of the following:

• Process development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.
• Design of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement.
• Experience with plasma etch equipment platforms.

Preferred Qualifications

• Experience in wafer-level assembly, advanced packaging, or related technologies.
• Demonstrated success in leading programs from initial strategy development through high-volume production.
• Technical leadership experience in solving complex engineering challenges and driving industry-leading solutions.
• Strong cross-functional collaboration skills with stakeholders in yield, operations, and other functional areas.

Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the boundaries of semiconductor technology. Join us to help shape the future of innovation. Apply now and become a part of Intel's mission to create world-changing technologies that improve lives.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Oregon, Hillsboro

Additional Locations

N/A

Business Group

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range

$133,800.00 - 255,200.00 USD

Work Model for this Role

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Additional Information

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.