Integration Engineer (52203)

Socket.dev; Milpitas (CA); On-site; USD 130,000 - 178,000; Full time

Job summary

TDK/Headway Technologies, Inc. in Milpitas, CA is seeking an Integration Engineer to lead wafer-level process integration and characterization for next-generation technology programs. The role focuses on experimentation, failure analysis, and data-driven improvements.

Requirements include a BS in engineering or physics and 3+ years in semiconductor process integration or characterization; JMP experience is a plus. Eligible for standard benefits with a competitive base salary.

Qualifications

• Bachelor’s degree in Electrical Engineering, Materials Science, or Physics; Master’s or PhD preferred.
• Three years of hands-on experience in process integration or characterization in a semiconductor environment.
• Hands-on experience using JMP or similar analytical application.
• Proficient in Microsoft Office applications.

Responsibilities

• Develops and delivers process integration and characterization techniques for new technology programs and next generation products.
• Designs and conducts experiments to verify process robustness; analyzes data and performs FMEA to meet product requirements.
• Performs wafer level process characterization on thin film recording heads using FIB and CD-SEM; identifies defects and provides corrective actions.
• Reviews backend performance data and makes recommendations to improve performance.
• Communicates findings to teams and management; adheres to safety policies.

Skills

Process integration

Characterization

Data analysis

Root cause analysis

Communication

Time management

Education

Bachelor’s degree in Electrical Engineering, Materials Science, or Physics

Master’s or PhD preferred

Tools

JMP

MS Visual Basic

FIB tool

CD-SEM

Job description

Job Details

Job Location: Milipitas, CA 95035

Position Type: Full Time

Education Level: 4 Year Degree

Salary Range: $129,819.00 - $177,675.00 Salary/year

Job Shift: Days

TITLE: INTEGRATION ENGINEER

FLSA STATUS: EXEMPT

REPORTS TO: SR. MANAGER, READER INTEGRATION

SUMMARY:

Under the direction of the Sr. Manager of Reader Integration, the Integration Engineer is responsible for the process integration and characterization of prototype wafers for new technology programs and next generation projects, including performing wafer level process characterization, conducting failure analysis on prototype wafers and recommending corrective action, and reviewing, monitoring, and analyzing backend performance data. This position is located in Milpitas, California.

ESSENTIAL FUNCTIONS:

• Develops and delivers process integration and characterization techniques for new technology programs and next generation products
• Designs and conducts experiments to verify process robustness; analyzes data, perform FMEA to meet the product requirements.
• Works on characterization or integration projects of various scope and complexity; ensures they are completed within the established timeframe
• Conducts failure analysis on newly developed processes and recommends corrective action if necessary
• Participates in characterization or integration projects of various scope and complexity; ensures they are completed within the established timeframe
• Performs wafer level process characterization on thin film recording heads using Focused Ion Beam (FIB) tool and CD-SEM to identify defects and provides corrective actions to resolve the issues promptly
• Reviews and analyzes backend performance data and makes recommendations to improve performance
• Analyzes data using JMP, MS Visual Basic, or similar software application to determine the root cause of process variations; develops charts or reports and presents findings before groups or teams
• Responds to inquiries from other team members, managers, or departments
• Adheres to all safety policies and procedures as required
• Performs other duties of a similar nature or level*

Qualifications

MINIMUM QUALIFICATIONS:

• Bachelor’s degree in Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; Master’s or PhD degree preferred
• Three years of hands on experience working in the process integration or characterization in a semiconductor environment in a manufacturing or process engineering role
• Hands’ on experience using JMP or similar analytical application
• Proficient in the use of Microsoft Office Applications

Required Knowledge, Skills, and Abilities:

• Knowledge of process integration and characterization principles, practices, and techniques
• Knowledge of magnetic recording head or HDD manufacturing
• Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
• Able to design experiments, analyze results, and recommend corrective action
• Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
• Able to work productively and collaboratively with all levels of employees and management
• Able to comply with all safety policies and procedures
• Able to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements
• Demonstrated analytical skills
• Demonstrated organizational and time management skills
• Demonstrated problem-solving and trouble shooting skills
• Flexible and able to prioritize

WORKING CONDITIONS:

The Integration Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Also works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; may be exposed to loud noise. Stands, walks, bends, twists, and crawls. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment; may occasionally push, pull, or lift up to 20 pounds.

The annual base salary for this full-time position is between $120,819.00-$177,675.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically. *Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.

TDK/Headway Technologies, Inc. is an Equal Opportunity Employer. We are committed to providing equal employment opportunities to all employees and applicants and prohibit discrimination, harassment, and retaliation of any kind. Employment decisions are made without regard to race, color, ancestry, national origin, religion, creed, sex, gender, gender identity, gender expression, sexual orientation, age, physical or mental disability, medical condition, genetic information, marital status, military or veteran status, reproductive health decision‑making, or any other characteristic protected by federal, state, or local law. Applicants and employees who require a reasonable accommodation to participate in the application process or perform the essential functions of a position should contact the Headway Human Resources Department.