Wafer Process Engineer (IRSP) 2nd Shift

Micross Company; Durham (NC); On-site; USD 85,000 - 120,000; Full time

Benefits offered by this job

Medical

HSA and FSA plans

Dental

Vision

Life Insurance

Employee Assistance Program

401k with employer match

Paid leave

Vacation

Holidays

Tuition assistance

529 College Savings

Pet insurance

Legal insurance

Well-being programs

Job summary

Micross Components is seeking a Wafer Process Engineer (IRSP) for the 2nd shift to support wafer processing steps and IR emitter pixel development. You will learn PVD, photoreist coats, etching, descums, US strips, and metrology while aligning with program schedules.

You will also gain exposure to interconnects on wafers (TSV, flip-chip bumps, Cu pillars) and participate in external/internal projects, collaborating with cross-functional teams.

Qualifications

• A.A., B.S., M.S., or PhD in physical science or engineering with wafer processing and cleanroom experience.
• Background in thin film deposition, dry/wet etch, and photolithography.
• Experience with metrology measurements and data presentation is a plus.

Responsibilities

• Hands-on engineering resource for fabricating IR emitter pixels on test and device wafers.
• Communicate results in a collaborative, data-driven environment.
• Conduct process improvement experiments and record data accurately.
• Apply standard troubleshooting protocols.

Skills

Hands-on lab skills

Data analysis

Report generation

Microsoft Office

Education

Degree in physical science or engineering

Tools

PowerPoint

Job description

If you are unable to complete this application due to a disability, contact this employer to ask for an accommodation or an alternative application process.

Wafer Process Engineer (IRSP) 2nd Shift

With a 45 year + heritage Micross Components began transforming specialty electronics by creating a global company with the broadest offering of products and services in the industry and quickly became recognized as the leading worldwide single-source supplier of specialty microelectronic components designed and manufactured to the highest quality standards.

Over the years, Micross Components acquired the specialized knowledge of these regional industry leaders to create a single-source solution for integrated circuits of all types and interconnect options.

And today, Micross continues to serve the Aerospace & Defense, Space, Medical, Industrial & Commercial markets with the most comprehensive range of hi-reliability microelectronic components and services available from one source.

Summary:

The position will primarily focus on learning and supporting wafer processing steps required to further develop and build IR emitter pixels for the IRSP program area. This includes thin film deposition by PVD, photoreist coats, photoresist develops, dry etches (RIE and ion mill), descums, ultrasonic (US) resist strips, immersion wet etches, microscope inspections, and thin film metrology. The successful candidate will need to develop an understanding of relevant process integration dependencies (e,g. interaction of patterned resist with etch processes). Understanding the importance of processing results and the need for supporting program schedules is critical. As time permits, a secondary goal is to become familiar with the process flows required to fabricate advanced interconnects on passive and/or active device wafers (e.g. through-Si Vias (TSV), flip-chip bumps, Cu pillars, redistribution layers, high density microbumps, and Si interposers). This position will support both externally and internally funded projects.

• Hands-on engineering resource for fabricating IR emitter pixels on test and device wafers
• Communicating results and concerns in a collaborative, data-driven environment
• Participate and conduct process improvement experiments, as needed; accurately recording and reporting data
• Employ standard troubleshooting protocols

Other Duties & Responsibilities:

• Comply with all safety policies, practices and procedures
• Comply with all quality and ITAR policies, practices and procedures
• Build meaningful and productive relationships with internal business partners
• Participate in proactive team efforts to achieve departmental and company goals
• Contribute to building a positive team spirit
• Communicate effectively with all levels of employees
• Protect confidential information by not communicating, disclosing to, or using for benefit of 3rd parties
• Maintain the highest degree of honesty and integrity at all times
• Perform other duties as assigned

Job Qualifications:

• Due to ITAR regulations, must be US Person
• A.A., B.S., M.S., or PhD in physical science or engineering with wafer processing and cleanroom experience
• Knowledge of wafer processes and basic device processing, with a good background in thin film deposition, dry/wet etch, and photolithography
• Overall experience with metrology measurements, data recording, and data presentation (PowerPoint) is a plus

Job Skills:

• Excellent hands-on laboratory skills
• Excellent written and verbal communication skills
• Should be able to collect and analyze data
• Proficient in Microsoft Office
• Be able to generate reports
• Should possess strong analytical skills

At Micross, our Core Values of integrity, communication, teamwork, quality and execution, self-discipline and accountability are cultivated throughout all levels of the organization.Micross provides a challenging and enjoyable workplace for members and supports the needs of the community.

Micross provides competitive benefits including:

• medical
• HSA and FSA plans
• dental
• vision
• company paid basic Life Insurance
• Employee Assistance Program (EAP)
• 401k with employer match
• paid leave
• vacation
• holidays
• generous tuition assistance
• 529 College Savings
• Pet insurance
• Legal insurance
• a range of well-being programs available.