Wafer Process Engineer – IRSP Pixels (2nd Shift)

Micross Company; Durham (NC); On-site; USD 85,000 - 120,000; Full time

Benefits offered by this job

Medical

HSA and FSA plans

Dental

Vision

Life Insurance

Employee Assistance Program

401k with employer match

Paid leave

Vacation

Holidays

Tuition assistance

529 College Savings

Pet insurance

Legal insurance

Well-being programs

Job summary

Micross Components is seeking a Wafer Process Engineer (IRSP) for the 2nd shift to support wafer processing steps and IR emitter pixel development. You will learn PVD, photoreist coats, etching, descums, US strips, and metrology while aligning with program schedules.

You will also gain exposure to interconnects on wafers (TSV, flip-chip bumps, Cu pillars) and participate in external/internal projects, collaborating with cross-functional teams.

Qualifications

• A.A., B.S., M.S., or PhD in physical science or engineering with wafer processing and cleanroom experience.
• Background in thin film deposition, dry/wet etch, and photolithography.
• Experience with metrology measurements and data presentation is a plus.

Responsibilities

• Hands-on engineering resource for fabricating IR emitter pixels on test and device wafers.
• Communicate results in a collaborative, data-driven environment.
• Conduct process improvement experiments and record data accurately.
• Apply standard troubleshooting protocols.

Skills

Hands-on lab skills

Data analysis

Report generation

Microsoft Office

Education

Degree in physical science or engineering

Tools

PowerPoint

Job description

Micross Components is seeking a Wafer Process Engineer (IRSP) for the 2nd shift to support wafer processing steps and IR emitter pixel development. You will learn PVD, photoreist coats, etching, descums, US strips, and metrology while aligning with program schedules.

You will also gain exposure to interconnects on wafers (TSV, flip-chip bumps, Cu pillars) and participate in external/internal projects, collaborating with cross-functional teams.