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Microchip Technology Inc. is seeking a Principal Process Engineer to support wafer fab tools and processes across Photo, Etch, Deposition, or Diffusion in diodes on silicon and GaAs wafers.
The role focuses on commercial and military communication/RADAR instrumentation markets. The candidate will act as a subject matter expert, optimize equipment and process performance, and lead teams to improve yields, cycle time, and cost.
We are looking for a Principal Process Engineer to support wafer fab tools and processes in one or more functional areas such as Photo, Etch, Deposition, or Diffusion at a facility that produces PIN, Zener, and Schottky diodes on silicon and gallium arsenide wafers, emphasizing commercial and military communication/RADAR & instrumentation markets.
This position requires access to technology, materials, software, or hardware that is controlled by U.S. export laws. Candidates must provide proof of U.S. citizenship, permanent U.S. residency, or a protected status as defined in 8 USC 1324b(a)(3).
0% – 25% travel.
Lift up to 25 lbs, push or pull 25 lbs, carry 15 lbs. Sit 10% of shift, stand 60%, walk 40%. Must perform activities including stooping, reaching, handling, hearing, talking, seeing, and working alone or with others.
Annual base salary range for this position in the U.S. is $75,000 – $232,000.* Range depends on location, skills, and experience.
Microchip Technology Inc. is an equal‑opportunity/affirmative‑action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected veteran status, age, or any other characteristic protected by law.