Wafer Probe Integration Engineer — Global Impact & Innovation

Micron Technology, Inc; Boise (ID); On-site; USD 110,000 - 140,000; Full time

Job summary

Micron Technology, Inc. in Boise, Idaho seeks a Wafer Probe Integration Engineer to deploy advanced wafer probing equipment and processes. You will collaborate with global teams, drive improvements, and ensure equipment performance meets quality standards.

Requirements include a Master’s degree in Mechanical or Electrical Engineering, strong knowledge of statistics, DOE, 3D CAD, and semiconductor processes, plus program management experience. Travel may be required to international sites.

Qualifications

• Master's degree required in Mechanical or Electrical Engineering or related field.
• Strong foundation in statistics, data analysis, and design of experiments.
• Experience with 3D CAD software and semiconductor processes.

Responsibilities

• Deploy first-of-a-kind equipment and process capabilities for wafer probe.
• Collaborate with global teams to establish best-known methods for wafer probe.
• Engage equipment suppliers to address quality and performance issues.
• Establish manufacturing metrics to drive continuous improvement of equipment and processes.
• Develop and deploy new methods to resolve manufacturing issues.
• Generate equipment specifications to meet safety and capability requirements.
• Perform statistical analysis of manufacturing data to ensure quality standards.
• Present information to manufacturing teams and Engineering Managers.
• Maintain collaboration with Manufacturing, Test Engineering, Process Engineering, and Quality Assurance.
• Initiate and chair meetings with global manufacturing sites.
• Position may require international travel.

Skills

Statistics

Design of experiments

3D CAD

Semiconductor processes

Program management

Education

Master's degree in Mechanical or Electrical Engineering

Tools

3D CAD software

Job description

Micron Technology, Inc. in Boise, Idaho seeks a Wafer Probe Integration Engineer to deploy advanced wafer probing equipment and processes. You will collaborate with global teams, drive improvements, and ensure equipment performance meets quality standards.

Requirements include a Master’s degree in Mechanical or Electrical Engineering, strong knowledge of statistics, DOE, 3D CAD, and semiconductor processes, plus program management experience. Travel may be required to international sites.