Senior Probe Card Engineer — Lead FOAK Tech

Micron Memory Malaysia Sdn Bhd; Boise (ID); On-site; USD 120,000 - 190,000; Full time

Job summary

Micron Technology, Inc. in Boise, Idaho seeks a Senior/Staff Probe Card Engineer to design and qualify probe cards that enable current and next‑generation device roadmaps. You will work with test, assembly, design, and product engineering teams to deliver robust solutions for high‑volume manufacturing.

The role requires 10+ years in probe card design, strong analog and SI/PI expertise, 3D CAD, DOE, and the ability to lead global supplier programs and cross‑site meetings.

Qualifications

• 10+ years of hands-on probe card design experience; BS/AS degree or equivalent.
• Strong grasp of analog circuits, component selection, SI/PI, and mechanical thermal properties (CTE matching).
• Reading schematics/mechanical specs and hands-on validation using wafer test cells (Probers/Testers).
• Mastery of 3D CAD software, statistics, data analysis, and Design of Experiments (DOE).
• Highly self-initiated with the ability to manage multiple concurrent designs and communicate complex technical data to leadership.

Responsibilities

• Own probe card design specifications and bond pad layouts to meet device roadmap requirements.
• Qualify FOAK technologies and define new equipment specifications to meet targets.
• Debug pre-production issues and perform root-cause analysis with data review.
• Manage global supplier base and lead cross-site technical alignment meetings.
• Collaborate with internal teams and present insights to leadership.

Skills

Analog circuits

SI/PI

3D CAD

Data analysis

DOE

Root-cause analysis

Probers/Testers

Education

BS/AS degree or equivalent

Tools

Probers/Testers

3D CAD software

Statistics software

Job description

Micron Technology, Inc. in Boise, Idaho seeks a Senior/Staff Probe Card Engineer to design and qualify probe cards that enable current and next‑generation device roadmaps. You will work with test, assembly, design, and product engineering teams to deliver robust solutions for high‑volume manufacturing.

The role requires 10+ years in probe card design, strong analog and SI/PI expertise, 3D CAD, DOE, and the ability to lead global supplier programs and cross‑site meetings.