TSR Pre-Sales Solutions

Lanner Electronics Inc.; Fremont (CA); Sur place; USD 110 000 - 170 000; Plein temps

Résumé du poste

Lanner Electronics Inc. seeks a Technical Sales Representative (Pre-Sales) to bridge customer requirements with engineering, size edge AI solutions, and generate BOMs for IoT and industrial deployments.

The role focuses on evaluating feasibility, drafting technical responses, and delivering compelling, hardware-centric proposals. You will collaborate with ISVs and silicon vendors, translate workloads into platform configurations, and accelerate deal velocity through precise RFP/RFQ leadership

Qualifications

• 4+ years in a customer-facing Pre-Sales or Applications Engineering role in IPC/edge hardware.
• Solid understanding of x86 and ARM architectures, memory, PCIe, storage, and I/O.
• Experience reading and responding to technical RFPs/RFIs/RFQs.
• Willingness to travel up to 10% for events and meetings.

Responsabilités

• Evaluate client needs, size solutions, and drive pre-sales deal velocity.
• Translate workloads into hardware configurations, BOMs, and product specs.
• Lead technical sections of RFP/RFQ responses with documentation and drawings.
• Prepare customer-facing materials by verticals (Smart transport, manufacturing, robotics, security).
• Collaborate with HQ and partners to align software/hardware requirements.

Connaissances

Pre-Sales Experience

Hardware Architecture Fluency

IPC/Edge Hardware Familiarity

Software RFP/RFQ literacy

Travel up to 10%

Formation

Associate's or Bachelor's in Electrical Engineering or Computer Engineering

Outils

RFP/RFQ Documentation

Description du poste

Technical Sales Representative (TSR) – Pre-Sales Solutions

serves as the core technical resource driving opportunity qualification, solution sizing, and deal evaluation within the Edge AI Ecosystem Alliance and Business Development organization. Reporting into the Alliances Director, this individual contributor bridges technical requirements between prospective clients, strategic ecosystem partners, and internal engineering. The TSR focuses on evaluating client technical needs, architecting hardware BOM, aligning specifications with Lanner platforms, and completing technical RFP/RFQ documentation to accelerate pre-sales deal velocity.

Key Responsibilities:

Pre-Sales Evaluation & Opportunity Qualification

• Technical Discovery & Qualification: Participate in early customer and partner sales calls to assess technical feasibility, evaluate system requirements, and determine the optimal AstraEdge hardware configurations for the use case.
• Hardware Sizing & BOM Generation: Translate client application workloads, camera/sensor counts, and environmental requirements into detailed hardware configurations, compute/memory sizing, and component Bills of Materials (BOMs).
• RFP/RFQ Technical Leadership: Drive and author the technical response sections of incoming RFPs, RFIs, and RFQs, ensuring all compliance matrices, mechanical drawings, thermal parameters, and interface requirements are addressed accurately.
• Product Marketing: Develop customer-facing material to convey key feature sets to customers by vertical (Smart transportation, manufacturing, robotics, enterprise AI, security & surveillance)

Alliance & Partner Technical Alignment

• ISV & Silicon Spec Matching: Work alongside partner teams (silicon vendors like NVIDIA/AMD/Intel/Qualcomm and computer vision/security ISVs) to map their minimum and recommended software and hardware requirements directly to the company's product line.
• Joint Pre-Sales Enablement: Assist in evaluating joint customer inquiries originating from partner co-selling motions, providing rapid turnaround on technical feasibility and hardware availability.
• Documentation & Technical Collateral: Assist in creating technical product selection guides, system compatibility matrices, and hardware comparison sheets used by sales reps and partner managers.

Cross-Functional HQ Collaboration

• HQ (Taiwan) Product Planning Interface: Channel customer design-in requirements, customization requests (ODM/OEM scope), and field-level competitive findings to HQ product management and engineering teams.
• Pipeline & Opportunity Tracking: Maintain technical progress records and requirement notes in the CRM to ensure clear tracking from initial qualification through commercial quoting.

Required Qualifications

• Experience: 4+ years of experience in a customer-facing Pre-Sales, Applications Engineering, or Technical Support role within the industrial PC (IPC), embedded computing, or edge hardware sectors. Solution deployment & software integration experience considered.
• Hardware Architecture Fluency: Solid understanding of x86 and ARM processor architectures, system memory types, PCIe lane assignments, storage interfaces, and standard industrial I/O (GigE, USB, CAN bus, COM, GMSL).
• Environmental & Mechanical Acumen: Familiarity with mechanical form factors, thermal dissipation principles (passive vs. active cooling), and industrial certifications/standards (IP ratings, shock/vibration).
• Pre-Sales Documentation: Proven ability to read, interpret, and respond to technical RFP/RFQ/RFI documents, spec sheets, and engineering drawings.
• Travel: Ability to travel up to 10% for Trade shows, Customer Meetings, and company events
• Education: Associate's or Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or equivalent technical work experience.

Preferred Qualifications

• ODM / OEM Experience: Direct background working with or for an Original Design Manufacturer (ODM) or Industrial PC vendor, with knowledge of customized chassis, custom carrier boards, or modified COTS hardware cycles.
• ISV Ecosystem Familiarity: Experience collaborating with Independent Software Vendors (ISVs)—particularly in edge AI, video analytics, physical & agentic AI, and robotics.
• Software: High-level understanding of edge OS deployments (Linux/Ubuntu, Jetpack/Deepstream) and containerization basics (Docker) to effectively assess software compatibility requirements.