TSR Pre-Sales Solutions

ADP, Inc.; Fremont (CA); On-site; USD 95,000 - 105,000; Full time

Job summary

ADP, Inc. in Fremont, CA is seeking a Technical Sales Representative (Pre-Sales) to drive opportunity qualification and solution sizing within the Edge AI ecosystem alliance.

You will collaborate with customers and partners to translate requirements into hardware configurations and prepare technical responses. The role requires 4+ years in pre-sales or related technical fields, with strong knowledge of hardware architectures and RFP/RFQ processes, and will involve up to 10% travel to customer

Qualifications

• 4+ years in a customer-facing Pre-Sales, Applications Engineering, or Technical Support role in IPC/embedded/edge hardware sectors.
• Solid understanding of x86 and ARM architectures, memory, PCIe, storage interfaces, and industrial I/O.
• Experience reading and responding to technical RFP/RFQ/RFI documents, specs, and drawings.

Responsibilities

• Pre-Sales Evaluation & Opportunity Qualification: assess feasibility and determine optimal hardware configurations.
• Hardware Sizing & BOM Generation: translate workloads into BOMs and sizing.
• RFP/RFQ Technical Leadership: drive technical response sections and ensure compliance matrices are addressed.
• Product Marketing: create customer-facing materials for verticals such as Smart transportation, manufacturing, robotics, and security.

Skills

Pre-Sales

Hardware sizing

RFP/RFQ

Technical documentation

Customer-facing

Education

Associate's or Bachelor's degree in Electrical/Computer Engineering/CS or equivalent

Tools

Docker

Linux/Ubuntu

Job description

If you are unable to complete this application due to a disability, contact this employer to ask for an accommodation or an alternative application process.

Full Time Sales Fremont, CA, US

16 days ago Requisition ID: 1019

Salary Range: $95,000.00 To $105,000.00 Annually

The Technical Sales Representative (TSR) – Pre-Sales Solutions serves as the core technical resource driving opportunity qualification, solution sizing, and deal evaluation within the Edge AI Ecosystem Alliance and Business Development organization. Reporting into the Alliances Director, this individual contributor bridges technical requirements between prospective clients, strategic ecosystem partners, and internal engineering. The TSR focuses on evaluating client technical needs, architecting hardware BOM, aligning specifications with Lanner platforms, and completing technical RFP/RFQ documentation to accelerate pre-sales deal velocity.

Key Responsibilities:

Pre-Sales Evaluation & Opportunity Qualification

• Technical Discovery & Qualification: Participate in early customer and partner sales calls to assess technical feasibility, evaluate system requirements, and determine the optimal AstraEdge hardware configurations for the use case.
• Hardware Sizing & BOM Generation: Translate client application workloads, camera/sensor counts, and environmental requirements into detailed hardware configurations, compute/memory sizing, and component Bills of Materials (BOMs).
• RFP/RFQ Technical Leadership: Drive and author the technical response sections of incoming RFPs, RFIs, and RFQs, ensuring all compliance matrices, mechanical drawings, thermal parameters, and interface requirements are addressed accurately.
• Product Marketing: Develop customer-facing material to convey key feature sets to customers by vertical (Smart transportation, manufacturing, robotics, enterprise AI, security & surveillance)

Alliance & Partner Technical Alignment

• ISV & Silicon Spec Matching: Work alongside partner teams (silicon vendors like NVIDIA/AMD/Intel/Qualcomm and computer vision/security ISVs) to map their minimum and recommended software and hardware requirements directly to the company's product line.
• Joint Pre-Sales Enablement: Assist in evaluating joint customer inquiries originating from partner co-selling motions, providing rapid turnaround on technical feasibility and hardware availability.
• Documentation & Technical Collateral: Assist in creating technical product selection guides, system compatibility matrices, and hardware comparison sheets used by sales reps and partner managers.

Cross-Functional HQ Collaboration

• HQ (Taiwan) Product Planning Interface: Channel customer design-in requirements, customization requests (ODM/OEM scope), and field-level competitive findings to HQ product management and engineering teams.
• Pipeline & Opportunity Tracking: Maintain technical progress records and requirement notes in the CRM to ensure clear tracking from initial qualification through commercial quoting.

Required Qualifications

• Experience: 4+ years of experience in a customer-facing Pre-Sales, Applications Engineering, or Technical Support role within the industrial PC (IPC), embedded computing, or edge hardware sectors. Solution deployment & software integration experience considered.
• Hardware Architecture Fluency: Solid understanding of x86 and ARM processor architectures, system memory types, PCIe lane assignments, storage interfaces, and standard industrial I/O (GigE, USB, CAN bus, COM, GMSL).
• Environmental & Mechanical Acumen: Familiarity with mechanical form factors, thermal dissipation principles (passive vs. active cooling), and industrial certifications/standards (IP ratings, shock/vibration).
• Pre-Sales Documentation: Proven ability to read, interpret, and respond to technical RFP/RFQ/RFI documents, spec sheets, and engineering drawings.
• Travel: Ability to travel up to 10% for Trade shows, Customer Meetings, and company events
• Education: Associate's or Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or equivalent technical work experience.

Preferred Qualifications

• ODM / OEM Experience: Direct background working with or for an Original Design Manufacturer (ODM) or Industrial PC vendor, with knowledge of customized chassis, custom carrier boards, or modified COTS hardware cycles.
• ISV Ecosystem Familiarity: Experience collaborating with Independent Software Vendors (ISVs)—particularly in edge AI, video analytics, physical & agentic AI, and robotics.
• Software: High-level understanding of edge OS deployments (Linux/Ubuntu, Jetpack/Deepstream) and containerization basics (Docker) to effectively assess software compatibility requirements.