TSR Pre-Sales Solutions

Lanner Electronics USA Inc

Fremont (CA)

On-site

USD 95,000 - 105,000

Full time

7 days ago
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Job summary

Lanner Electronics USA Inc is seeking a dynamic Pre-Sales / Applications Engineer in Fremont, CA to help qualify opportunities and tailor hardware solutions for customers. You will size hardware, generate BOMs, and lead technical responses to RFx while collaborating with partner teams and ISVs.

The role requires 4+ years in IPC/edge hardware, strong knowledge of x86/ARM, and the ability to travel up to 10%. You will craft technical collateral and support HQ alignment on customer requirements.

Qualifications

  • 4+ years of experience in a customer-facing Pre-Sales, Applications Engineering, or Technical Support role in IPC/edge hardware.
  • Solid understanding of x86 and ARM processor architectures, memory types, PCIe lanes, storage interfaces, and standard industrial I/O.
  • Familiarity with mechanical form factors, thermal dissipation, IP ratings, and industrial certifications.
  • Ability to read, interpret, and respond to technical RFx/RFP/RFI documents and drawings.
  • Willingness to travel up to 10% for trade shows, meetings, and events.

Responsibilities

  • Participate in early customer and partner sales calls to assess technical feasibility and hardware configurations.
  • Translate workloads into detailed hardware configurations, BOMs, and environmental requirements.
  • Lead the technical sections of RFP/RFI/RFQ responses with accuracy and compliance.
  • Create customer-facing materials highlighting key feature sets by verticals (Smart transportation, manufacturing, robotics, enterprise AI, security).
  • Collaborate with silicon vendors and ISVs to map requirements to the product line.
  • Support joint pre-sales enablement and rapid feasibility assessments for partner inquiries.
  • Develop system compatibility matrices and hardware comparison sheets for sales use.
  • Coordinate with HQ product planning to relay customer requirements and field findings.

Skills

Pre-Sales
Customer-facing
Technical documentation
Hardware sizing

Education

Electrical/Computer Engineering degree

Tools

Docker

Job description

If you are unable to complete this application due to a disability, contact this employer to ask for an accommodation or an alternative application process.

Full Time Sales Fremont, CA, US

Salary Range: $95,000.00 To $105,000.00 Annually

Key Responsibilities
Pre-Sales Evaluation & Opportunity Qualification
  • Technical Discovery & Qualification: Participate in early customer and partner sales calls to assess technical feasibility, evaluate system requirements, and determine the optimal AstraEdge hardware configurations for the use case.
  • Hardware Sizing & BOM Generation: Translate client application workloads, camera/sensor counts, and environmental requirements into detailed hardware configurations, compute/memory sizing, and component Bills of Materials (BOMs).
  • RFP/RFQ Technical Leadership: Drive and author the technical response sections of incoming RFPs, RFIs, and RFQs, ensuring all compliance matrices, mechanical drawings, thermal parameters, and interface requirements are addressed accurately.
  • Product Marketing: Develop customer-facing material to convey key feature sets to customers by vertical (Smart transportation, manufacturing, robotics, enterprise AI, security & surveillance)
Alliance & Partner Technical Alignment
  • ISV & Silicon Spec Matching: Work alongside partner teams (silicon vendors like NVIDIA/AMD/Intel/Qualcomm and computer vision/security ISVs) to map their minimum and recommended software and hardware requirements directly to the company's product line.
  • Joint Pre-Sales Enablement: Assist in evaluating joint customer inquiries originating from partner co-selling motions, providing rapid turnaround on technical feasibility and hardware availability.
  • Documentation & Technical Collateral: Assist in creating technical product selection guides, system compatibility matrices, and hardware comparison sheets used by sales reps and partner managers.
Cross-Functional HQ Collaboration
  • HQ (Taiwan) Product Planning Interface: Channel customer design-in requirements, customization requests (ODM/OEM scope), and field-level competitive findings to HQ product management and engineering teams.
  • Pipeline & Opportunity Tracking: Maintain technical progress records and requirement notes in the CRM to ensure clear tracking from initial qualification through commercial quoting.
Required Qualifications
  • Experience: 4+ years of experience in a customer-facing Pre-Sales, Applications Engineering, or Technical Support role within the industrial PC (IPC), embedded computing, or edge hardware sectors. Solution deployment & software integration experience considered.
  • Hardware Architecture Fluency: Solid understanding of x86 and ARM processor architectures, system memory types, PCIe lane assignments, storage interfaces, and standard industrial I/O (GigE, USB, CAN bus, COM, GMSL).
  • Environmental & Mechanical Acumen: Familiarity with mechanical form factors, thermal dissipation principles (passive vs. active cooling), and industrial certifications/standards (IP ratings, shock/vibration).
  • Pre-Sales Documentation: Proven ability to read, interpret, and respond to technical RFP/RFQ/RFI documents, spec sheets, and engineering drawings.
  • Travel: Ability to travel up to 10% for Trade shows, Customer Meetings, and company events
  • Education: Associate's or Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or equivalent technical work experience.
Preferred Qualifications
  • ODM / OEM Experience: Direct background working with or for an Original Design Manufacturer (ODM) or Industrial PC vendor, with knowledge of customized chassis, custom carrier boards, or modified COTS hardware cycles.
  • ISV Ecosystem Familiarity: Experience collaborating with Independent Software Vendors (ISVs)—particularly in edge AI, video analytics, physical & agentic AI, and robotics.
  • Software: High-level understanding of edge OS deployments (Linux/Ubuntu, Jetpack/Deepstream) and containerization basics (Docker) to effectively assess software compatibility requirements.
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