Edge AI Pre-Sales Solutions Architect

Lanner Electronics Inc.; Fremont (CA); Presencial; USD 110.000 - 170.000; Jornada completa

Descripción de la vacante

Lanner Electronics Inc. seeks a Technical Sales Representative (Pre-Sales) to bridge customer requirements with engineering, size edge AI solutions, and generate BOMs for IoT and industrial deployments.

The role focuses on evaluating feasibility, drafting technical responses, and delivering compelling, hardware-centric proposals. You will collaborate with ISVs and silicon vendors, translate workloads into platform configurations, and accelerate deal velocity through precise RFP/RFQ leadership

Formación

• 4+ years in a customer-facing Pre-Sales or Applications Engineering role in IPC/edge hardware.
• Solid understanding of x86 and ARM architectures, memory, PCIe, storage, and I/O.
• Experience reading and responding to technical RFPs/RFIs/RFQs.
• Willingness to travel up to 10% for events and meetings.

Responsabilidades

• Evaluate client needs, size solutions, and drive pre-sales deal velocity.
• Translate workloads into hardware configurations, BOMs, and product specs.
• Lead technical sections of RFP/RFQ responses with documentation and drawings.
• Prepare customer-facing materials by verticals (Smart transport, manufacturing, robotics, security).
• Collaborate with HQ and partners to align software/hardware requirements.

Conocimientos

Pre-Sales Experience

Hardware Architecture Fluency

IPC/Edge Hardware Familiarity

Software RFP/RFQ literacy

Travel up to 10%

Educación

Associate's or Bachelor's in Electrical Engineering or Computer Engineering

Herramientas

RFP/RFQ Documentation

Descripción del empleo

Lanner Electronics Inc. seeks a Technical Sales Representative (Pre-Sales) to bridge customer requirements with engineering, size edge AI solutions, and generate BOMs for IoT and industrial deployments.

The role focuses on evaluating feasibility, drafting technical responses, and delivering compelling, hardware-centric proposals. You will collaborate with ISVs and silicon vendors, translate workloads into platform configurations, and accelerate deal velocity through precise RFP/RFQ leadership