Senior Power Delivery Engineer

Acceler8 Talent; Massachusetts; On-site; USD 120,000 - 170,000; Full time

Job summary

Acceler8 Talent is partnering with an early-stage semiconductor company to hire a Senior Power Delivery Engineer. You will own power-delivery architecture for high-density hardware and drive trade-offs across efficiency, density and thermal limits, from architecture through implementation.

You will work closely with packaging, SI/PI, thermal and systems engineers to resolve constraints, evaluate options quantitatively and shape the power-engineering approach as the team grows.

Qualifications

• Experience owning power-delivery systems from architecture to hardware.
• Hands-on debugging and bring-up of power hardware.
• Ability to justify design decisions with measured results.
• Experience across electrical, package and thermal boundaries.

Responsibilities

• Define power-delivery architecture for high-density systems.
• Drive trade-offs across conversion, distribution, efficiency, transient response, density, reliability and thermal limits.
• Own implementation, bring-up and debug with measured performance guiding decisions.
• Collaborate with packaging, SI/PI, thermal and systems engineers.
• Evaluate design choices quantitatively and inform improvements.
• Establish power-engineering practices for a founding-stage semiconductor team.

Skills

Power-delivery architecture

Hardware bring-up & debugging

Cross-functional collaboration

Quantitative design decisions

Thermal-aware design

Job description

We’re working with an early-stage semiconductor company developing a multi-material 3D integration platform. The approach combines materials such as GaN, silicon, glass and diamond to address circuit, packaging and thermal requirements together.

The initial focus is RF systems for radar and low-Earth-orbit communications, with a longer-term platform spanning power electronics, compute and photonics.

They’re hiring a Senior Power Delivery Engineer to lead power-delivery architecture for high-density hardware. The role brings electrical, package and thermal design together, with ownership from early architecture decisions through implementation and measured hardware.

The role

• Define power-delivery architecture for complex, high-density systems.
• Drive trade-offs across power conversion, distribution, efficiency, transient response, density, reliability and thermal limits.
• Own implementation, bring-up and debug, connecting measured performance with architecture and design decisions.
• Work closely with packaging, SI/PI, thermal and systems engineers to resolve integration constraints.
• Evaluate design choices quantitatively and use hardware results to guide improvements.
• Establish the power-engineering approach and working practices of a founding-stage semiconductor team.

Your experience

• Senior technical ownership of power-delivery systems from architecture through delivered hardware.
• Strong quantitative judgment across efficiency, power density, transient behaviour and reliability.
• Hands-on experience implementing, bringing up and debugging power hardware.
• The ability to explain your design decisions, measured results and the trade-offs behind them.
• Experience working across electrical, package and thermal boundaries.
• Comfort with broad responsibility, changing requirements and practical execution in a small team.

You’ll shape how power is delivered within a semiconductor platform where material choices, physical integration and thermal performance are closely connected.

The role offers broad architecture ownership, direct collaboration with the founding team and responsibility for carrying decisions through to working hardware. You’ll also help establish how power engineering develops as the company grows.

This is an opportunity for someone who wants to solve power-delivery problems across traditional engineering boundaries and take responsibility for the results.