Thermal Modeling Lead for CPU Core Design

Advanced Micro Devices

Santa Clara, Northern (CA, KY)

Hybrid

USD 150,000 - 210,000

Full time

14 days+
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Job summary

Advanced Micro Devices in Santa Clara, CA, seeks a Lead Physical Design Engineer to ensure CPU Cores and SOC meet thermal and silicon performance requirements. This technical role focuses on physical design methodology for power and thermal across IPs.

You will lead cross‑functional teams, drive end‑to‑end technical workstreams, and ensure timely closure of issues, risks, and dependencies with architecture, design implementation, and package modeling groups.

Qualifications

  • Strong physical design background with extensive EDA tool experience.
  • Excellent knowledge of physical design power and performance metrics for high‑performance SoC/IP design.
  • Familiarity with package models and advanced packaging designs.
  • Experience collaborating with pre‑silicon design and package modeling teams.
  • Expertise in scripting and flow automation.

Responsibilities

  • Drive development and alignment of thermal modeling methodology with package teams.
  • Drive new design and analysis methodologies to improve the product thermal profile.
  • Translate usage model, workload, and package requirements into IP performance, power, and thermal constraints.
  • Drive thermal product requirements across functions and manage key milestones.

Skills

Physical Design
Power & Performance Metrics
SoC/IP Design
Packaging Models
Scripting & Automation

Education

Bachelors or Masters in Computer Engineering or Electrical Engineering

Job description

Advanced Micro Devices in Santa Clara, CA, seeks a Lead Physical Design Engineer to ensure CPU Cores and SOC meet thermal and silicon performance requirements. This technical role focuses on physical design methodology for power and thermal across IPs.

You will lead cross‑functional teams, drive end‑to‑end technical workstreams, and ensure timely closure of issues, risks, and dependencies with architecture, design implementation, and package modeling groups.

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