Senior Thermal Engineer - HPC & SoC Cooling

Advanced Micro Devices; San Jose (CA); On-site; USD 140,000 - 190,000; Full time

Benefits offered by this job

Health benefits

401(k) match

Stock options

Job summary

AMD is seeking a Thermal Engineer in San Jose to advance the cooling solutions for next-generation SoCs, FPGAs, ASICs and HPC products. You will collaborate across teams to model, simulate, test and validate thermal performance throughout the product lifecycle.

You will apply heat transfer fundamentals, use CFD and thermal tools, and translate data into actionable design decisions, with a focus on reliability and manufacturability in a fast-paced environment.

Qualifications

• Master's or PhD in Mechanical or Aerospace Engineering or related field.
• Strong foundation in heat transfer and electronics cooling.
• Experience in thermal analysis of electronic systems and computing hardware.

Responsibilities

• Support thermal design for AMD's next-gen SoC/FPGA/ASIC products.
• Perform die, package, board, and system-level thermal simulations.
• Develop and execute thermal characterization plans for hardware platforms.
• Analyze thermal data and correlate measurements with models.
• Support air- and liquid-cooled thermal solutions for HPC products.
• Conduct thermal analysis and back-of-the-envelope calculations.
• Participate in thermal design reviews and recommendations.
• Engage with customers in thermal discussions and issue resolution.
• Document methodologies, test procedures, and engineering reports.

Skills

Thermal analysis

Modeling

Testing

CFD tools

Python

MATLAB

Data analysis

Cross-functional

Education

Master's degree in Mechanical / Aerospace Eng

Tools

SolidWorks

Creo

Ansys Icepak

FloTHERM

AEDT

Job description

AMD is seeking a Thermal Engineer in San Jose to advance the cooling solutions for next-generation SoCs, FPGAs, ASICs and HPC products. You will collaborate across teams to model, simulate, test and validate thermal performance throughout the product lifecycle.

You will apply heat transfer fundamentals, use CFD and thermal tools, and translate data into actionable design decisions, with a focus on reliability and manufacturability in a fast-paced environment.