Thermal Modeling Lead, CPU Core PD

CareerArc; Santa Clara (CA); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Benefits at a glance

Job summary

AMD in Santa Clara, CA, is seeking a lead Physical Design Engineer to ensure CPU cores and SOC meet thermal requirements and silicon performance. This role focuses on physical design methodology for power and thermals across IPs.

You will lead cross‑functional alignment with architecture, physical design implementation, and package modelling teams, owning end‑to‑end technical workstreams and resolving risks and dependencies.

Qualifications

• Strong physical design background with extensive EDA tool experience.
• Excellent knowledge of power and performance metrics for high‑performance SoC/IP design.
• Familiarity with package models and advanced packaging designs.
• Experience collaborating with pre‑silicon design and package modeling teams.
• Expertise in scripting and flow automation.

Responsibilities

• Drive development and alignment of thermal modelling methodology with package teams.
• Advance design and analysis methodologies to improve thermal profiles.
• Translate usage models and package requirements into IP power, performance, and thermal constraints.
• Manage critical deliverables at key project milestones across the team.

Skills

Physical design

EDA tools

Power & performance

SoC/IP design

Packaging/advanced packaging

Pre-silicon collaboration

Scripting & automation

Cross-functional leadership

Education

Bachelor's or Master's in Electrical/Computer Engineering

Tools

EDA tools

Job description

AMD in Santa Clara, CA, is seeking a lead Physical Design Engineer to ensure CPU cores and SOC meet thermal requirements and silicon performance. This role focuses on physical design methodology for power and thermals across IPs.

You will lead cross‑functional alignment with architecture, physical design implementation, and package modelling teams, owning end‑to‑end technical workstreams and resolving risks and dependencies.