CPU Core Physical Design Thermal Modeling Lead

Advanced Micro Devices; Santa Clara, Northern (CA, KY); On-site; USD 150,000 - 210,000; Full time

Job summary

Advanced Micro Devices in Santa Clara, CA, seeks a Lead Physical Design Engineer to ensure CPU Cores and SOC meet thermal and silicon performance requirements. This technical role focuses on physical design methodology for power and thermal across IPs.

You will lead cross‑functional teams, drive end‑to‑end technical workstreams, and ensure timely closure of issues, risks, and dependencies with architecture, design implementation, and package modeling groups.

Qualifications

• Strong physical design background with extensive EDA tool experience.
• Excellent knowledge of physical design power and performance metrics for high‑performance SoC/IP design.
• Familiarity with package models and advanced packaging designs.
• Experience collaborating with pre‑silicon design and package modeling teams.
• Expertise in scripting and flow automation.

Responsibilities

• Drive development and alignment of thermal modeling methodology with package teams.
• Drive new design and analysis methodologies to improve the product thermal profile.
• Translate usage model, workload, and package requirements into IP performance, power, and thermal constraints.
• Drive thermal product requirements across functions and manage key milestones.

Skills

Physical Design

Power & Performance Metrics

SoC/IP Design

Packaging Models

Scripting & Automation

Education

Bachelors or Masters in Computer Engineering or Electrical Engineering

Job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology can change lives for the better. It can heal us, entertain us, and make us more connected, productive, and understanding of the world around us. And we’re looking for talent who feel the same: people who want to leave the planet better than they found it, those who don’t shy away from humanity’s challenges but are determined to help solve them.

AMD is powering the next generation of supercomputing, high-performance computing, cloud, and AI. Whether you’re designing next-gen processors, enabling AI breakthroughs, or creating go-to-market plans, every role at AMD contributes to something bigger — technology that moves the world forward.

THE ROLE:

We are seeking a leadPhysical Design Engineer to ensure that CPU Cores and SOC meet Thermal requirements and Silicon Performance. This is a technical role focusing on Physical design methodology requirements for power and thermals across IPs.

THE PERSON:

You will be a proven technical leader with the ability to drive cross-functional alignment and execution across architecture, physical design implementation, package modeling teams, ensuring timely closure and multi-dimensional alignment of power, thermal management and performance constraints. You will also be highly organized and execution-driven, with demonstrated success owning end-to-end technical workstreams and driving closure of open issues, risks, and dependencies across program milestones.

KEY RESPONSIBLITIES:

• Drive development and alignment of thermal modeling methodology, collaborating with Package modeling teams across AMD products.
• Drive new design and analysis methodologies to improve product thermal profile.
• Translate product usage model, workload, and package requirements into IP performance, power, and thermal constraints and align with product performance-power models.
• Drive thermal product requirements cross-function, managing critical deliverables at key project milestones.

REFERRED EXPERIENCE:

• Strong Physical Design background with extensive EDA tool experience.
• Excellent knowledge of physical design power and performance metrics, and experience in high-performance SoC/IP design.
• Familiarity with package models and advance packaging designs.
• Familiarity collaborating with pre‑silicon design and package modeling teams and aligning architecture assumptions/targets with projections.
• Expertise in scripting and flow automation.

ACADEMIC CREDENTIALS:

• Bachelors or Masters degree in computer engineering/Electrical Engineering

LOCATION:

Santa Clara, CA, or other AMD offices (Austin, Fort Collins, Boxborough)

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.