Thermal Engineer

Oho Group; San Francisco (CA); Vor Ort; USD 120.000 - 180.000; Vollzeit

Zusammenfassung

OHO Group (Lithuania) is seeking a hands-on Thermal Engineer to join an AI infrastructure focus. You will bridge thermal modelling with physical hardware, simulate cooling performance, and validate designs across server, rack, and facility interfaces.

The role emphasizes early design influence, rigorous testing, and closing technical loops with stakeholders. You will develop and compare cooling options, assess both air-cooled and liquid-cooled configurations, and lead data-driven decisions from

Qualifikationen

• Hands-on thermal engineering experience focusing on heat transfer, fluid mechanics and thermodynamics.
• Experience designing and deploying data center infrastructure for Tier 1 or Tier 2 cloud providers.
• Direct experience building CFD or flow-network models to guide hardware decisions.
• Involvement with testing, instrumentation and model validation in real systems.
• Proficient with CFD/thermal simulation tools such as Fluent, Icepak, FloTHERM, STAR-CCM+ or COMSOL.

Aufgaben

• Develop thermal and fluid-flow models to evaluate cooling performance and identify constraints.
• Design and specify liquid-cooling solutions including CDU capacity and coolant conditions.
• Assess air-cooled and liquid-cooled configurations for high-density compute systems.
• Correlate simulation results with prototype and system-level measurements.
• Investigate thermal failures, identify root causes and drive corrective changes through testing.
• Collaborate with electrical, mechanical and systems engineers, suppliers and customers to turn requirements into practical designs.

Kenntnisse

Thermal engineering

DC infrastructure design

CFD & thermal modeling

Testing & validation

Simulation tools

Communication & ownership

Tools

Fluent

Icepak

FloTHERM

STAR-CCM+

COMSOL

Jobbeschreibung

Help solve the cooling challenges behind high-density AI infrastructure.

We’re partnering with an AI infrastructure company looking for a hands‑on thermal engineer to help develop cooling solutions for next‑generation data centers. You’ll connect thermal modelling with physical hardware, using simulation and testing to make design decisions across server, rack and facility cooling interfaces.

This is an opportunity to influence designs early, investigate difficult engineering problems and see your recommendations through to validation.

What you’ll work on

• Develop thermal and fluid-flow models to evaluate cooling performance, identify constraints and compare design options.
• Design and specify liquid‑cooling solutions, including CDU capacity, coolant conditions, flow distribution, pressure drop and heat rejection.
• Assess air‑cooled and liquid‑cooled configurations for high-density compute systems.
• Correlate simulation results with prototype and system‑level measurements.
• Investigate thermal failures, identify root causes and drive corrective changes through testing and technical closure.
• Work closely with electrical, mechanical and systems engineers, suppliers and customers to turn requirements into practical designs.

What we’re looking for

• Hands‑on thermal engineering experience, with strong heat‑transfer, fluid‑mechanics and thermodynamics fundamentals.
• Hands‑on experience designing and deploying data center infrastructure at a Tier 1 or Tier 2 cloud service provider.
• Experience personally building CFD, thermal or flow‑network models and using the results to guide hardware decisions.
• Practical involvement in testing, instrumentation and model validation.
• Experience with tools such as Fluent, Icepak, FloTHERM, STAR-CCM+, COMSOL or comparable simulation packages.
• The ability to explain engineering assumptions, evaluate trade‑offs and take ownership of technical problems.