Senior Thermal & Liquid Cooling Engineer

Metric DCX; Town of Texas (WI); In loco; USD 120.000 - 180.000; Tempo pieno

Descrizione del lavoro

Metric DCX is seeking a senior Mechanical Engineer to own thermal and cooling engineering for high-density AI infrastructure. You will drive design across air and liquid cooling, including Direct-to-Chip (D2C) architectures, and work with CDUs, heat exchangers, pumps and piping.

You will collaborate with electrical, controls, and deployment teams, perform thermal analyses, and lead design reviews, advancing cooling technologies as compute densities rise.

Competenze

• Strong mechanical/thermal background in data centers, HPC, AI infrastructure.
• Direct hands-on experience with Direct-to-Chip liquid cooling.
• Knowledge of liquid and air cooling technologies.
• Experience designing cooling systems from concept to deployment.
• Knowledge of CDUs, heat exchangers, pumps, piping, chilled water and heat rejection systems.
• Able to operate independently in a fast-moving engineering environment.

Mansioni

• Design and develop cooling solutions for high-density AI/data center environments.
• Lead mechanical engineering across air and liquid cooling systems.
• Develop and optimize Direct-to-Chip (D2C) liquid cooling architectures.
• Work with CDUs, liquid loops, heat exchangers, pumps, piping and related thermal infrastructure.
• Engineer air-side systems including CRAH/CRAC, chilled water and heat rejection systems.
• Perform thermal analysis, system sizing, equipment selection and design reviews.
• Collaborate with electrical, controls, infrastructure and deployment teams.
• Evaluate new cooling technologies as compute densities increase.

Conoscenze

Mechanical engineering

Thermal engineering

AI infrastructure

High-density environments

Independent work

Thermal analysis

System sizing

Strumenti

CDUs

Heat exchangers

CRAH/CRAC

Pumps

Chilled water systems

Descrizione del lavoro

Metric DCX is seeking a senior Mechanical Engineer to own thermal and cooling engineering for high-density AI infrastructure. You will drive design across air and liquid cooling, including Direct-to-Chip (D2C) architectures, and work with CDUs, heat exchangers, pumps and piping.

You will collaborate with electrical, controls, and deployment teams, perform thermal analyses, and lead design reviews, advancing cooling technologies as compute densities rise.