Mechanical Engineering

Metric DCX; Town of Texas (WI); On-site; USD 120,000 - 180,000; Full time

Job summary

Metric DCX is seeking a senior Mechanical Engineer to own thermal and cooling engineering for high-density AI infrastructure. You will drive design across air and liquid cooling, including Direct-to-Chip (D2C) architectures, and work with CDUs, heat exchangers, pumps and piping.

You will collaborate with electrical, controls, and deployment teams, perform thermal analyses, and lead design reviews, advancing cooling technologies as compute densities rise.

Qualifications

• Strong mechanical/thermal background in data centers, HPC, AI infrastructure.
• Direct hands-on experience with Direct-to-Chip liquid cooling.
• Knowledge of liquid and air cooling technologies.
• Experience designing cooling systems from concept to deployment.
• Knowledge of CDUs, heat exchangers, pumps, piping, chilled water and heat rejection systems.
• Able to operate independently in a fast-moving engineering environment.

Responsibilities

• Design and develop cooling solutions for high-density AI/data center environments.
• Lead mechanical engineering across air and liquid cooling systems.
• Develop and optimize Direct-to-Chip (D2C) liquid cooling architectures.
• Work with CDUs, liquid loops, heat exchangers, pumps, piping and related thermal infrastructure.
• Engineer air-side systems including CRAH/CRAC, chilled water and heat rejection systems.
• Perform thermal analysis, system sizing, equipment selection and design reviews.
• Collaborate with electrical, controls, infrastructure and deployment teams.
• Evaluate new cooling technologies as compute densities increase.

Skills

Mechanical engineering

Thermal engineering

AI infrastructure

High-density environments

Independent work

Thermal analysis

System sizing

Tools

CDUs

Heat exchangers

CRAH/CRAC

Pumps

Chilled water systems

Job description

Mechanical Engineer – Thermal & Liquid Cooling

Location: United States

We are partnered with a rapidly growing AI infrastructure company building the physical systems required to support next-generation, high-density compute environments.

They are looking for an experienced Mechanical Engineer to join as a senior individual contributor, owning thermal and cooling engineering across both traditional air-cooled and advanced liquid-cooled infrastructure.

The Role:

• Design and develop cooling solutions for high-density AI/data center environments.
• Lead mechanical engineering across both air and liquid cooling systems.
• Develop and optimize Direct-to-Chip (D2C) liquid cooling architectures.
• Work with CDUs, liquid loops, heat exchangers, pumps, piping and associated thermal infrastructure.
• Engineer air-side systems including CRAH/CRAC, chilled water and heat rejection systems.
• Perform thermal analysis, system sizing, equipment selection and design reviews.
• Work closely with electrical, controls, infrastructure and deployment teams.
• Evaluate new cooling technologies as compute densities continue to increase.
• Operate as a highly technical individual contributor with significant ownership over engineering decisions.

Requirements:

• Strong mechanical/thermal engineering background within data centers, HPC, AI infrastructure or similarly high-density environments.
• Direct hands-on experience with Direct-to-Chip liquid cooling is required.
• Strong understanding of both liquid and air cooling technologies.
• Experience designing mechanical cooling systems from concept through deployment.
• Knowledge of CDUs, heat exchangers, pumps, piping, chilled water and heat rejection systems.
• Comfortable operating independently in a fast-moving engineering environment.

This is an opportunity to take significant technical ownership within an early-stage infrastructure business tackling some of the most complex thermal challenges created by next-generation AI compute.