SOC Thermal Engineer

Apple; United States; On-site; USD 110,000 - 170,000; Full time

Job summary

Apple is seeking a Thermal Engineer to design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines.

The ideal candidate has a Bachelor's degree and extensive hands-on experience in thermal design, analysis, and validation for silicon devices, packaging, PCBs, or mobile products, using tools like Ansys IcePak, Fluent, and RedHawk.

Qualifications

• Bachelor's degree required.
• Demonstrated leadership capabilities at the senior engineer level.
• Deep expertise in thermal design for silicon devices and packaging solutions.
• Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies.
• Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches.
• Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics.
• Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs.
• Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products
• Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk.
• Experience designing and executing experimental test setups and analyzing thermal data.

Responsibilities

• Design and validate cooling solutions for high-performance computing systems.
• Perform simulations and testing to verify thermal performance.
• Collaborate with multi-functional teams across product lines to ensure thermal reliability.
• Analyze thermal data to optimize performance and reliability across devices and packaging.

Skills

Senior leadership

Thermal design

IC packaging physics

SoC design

Packaging know-how

Thermal testing

Thermal analysis

Test setups

Thermal data analysis

Education

Bachelor's degree

Tools

Ansys IcePak

Sentinel-TI

Fluent

Cadence Allegro

RedHawk

Job description

Do you love working on challenges that no one has yet solved? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device’s thermal performance and participate in advanced IC packaging research and development.

The Thermal Engineer will design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines.

Minimum Qualifications

Bachelor's degree required.

Preferred Qualifications

• Demonstrated leadership capabilities at the senior engineer level.
• Deep expertise in thermal design for silicon devices and packaging solutions.
• Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies.
• Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches.
• Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics.
• Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs.
• Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products
• Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk.
• Experience designing and executing experimental test setups and analyzing thermal data.