Founding Thermo-Mechanical Engineer – Boston, Onsite

Acceler8 Talent; Massachusetts; Presencial; USD 150.000 - 220.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Founding equity

Descripción de la vacante

Acceler8 Talent is seeking a Thermo-Mechanical Engineer for an onsite role in Boston, MA. The startup seeks a founder-level contributor to own thermal and mechanical design, driving first-principles solutions for next-generation 3D heterogeneous integration.

You will lead simulation, validation, and reliability programs for packaging, microbump fatigue, and die-attach considerations, shaping the platform from day one with an equity option among the founding team.

Formación

• PhD with 2+ years or MS with 5+ years of relevant experience, or equivalent practical experience.
• Strong experience with thermal and structural FEA using ANSYS, COMSOL, Icepak or similar tools.
• Experience with advanced semiconductor packaging, heterogeneous integration or 3D stacked die.
• Strong understanding of thermal management, mechanical stress, warpage and reliability.
• Hands-on experience with thermal measurement, validation or advanced cooling technologies.
• Experience with package-level simulations, microbump fatigue or die-attach reliability is a strong plus.

Responsabilidades

• Lead thermal and mechanical design from day one for a founding team project.
• Develop simulation and reliability methodologies to underpin the platform.
• Own complex engineering challenges from first principles.
• Collaborate across disciplines to ensure robust thermal management and packaging success.

Conocimientos

First principles thinking

Cross-functional collab

Educación

PhD +2 yrs or MS +5 yrs

Herramientas

ANSYS

COMSOL

Icepak

Descripción del empleo

Acceler8 Talent is seeking a Thermo-Mechanical Engineer for an onsite role in Boston, MA. The startup seeks a founder-level contributor to own thermal and mechanical design, driving first-principles solutions for next-generation 3D heterogeneous integration.

You will lead simulation, validation, and reliability programs for packaging, microbump fatigue, and die-attach considerations, shaping the platform from day one with an equity option among the founding team.