Thermal Design Engineer for HPC Server Hardware

AMD; Secaucus (NJ); On-site; USD 110,000 - 160,000; Full time

Job summary

AMD designs high-performance computing hardware and is seeking a skilled engineer to advance thermal solutions for rack mount servers. You will lead the thermal design, validation, and performance optimization using data-driven methods and simulations.

Ideal candidates have a Master’s in a related field and several years’ experience in HPC cooling, heat sink design, and TIM selection, with a focus on manufacturability and reliability.

Qualifications

• Master’s degree or foreign equivalent in Mechanical Engineering, Computer Engineering, or related field.
• Three years of experience in job offered or in a closely related engineering role.
• Alternate combination: Bachelor’s degree or foreign equivalent plus five years of progressive post-baccalaureate experience.
• Experience in thermal design, testing, and validation of HPC/AI/storage servers is preferred.

Responsibilities

• Load, test, and validate thermal solutions for rack mount servers and data centers.
• Recommend design changes and optimize configurations for cooling performance.
• Use CFD and thermal simulations to evaluate chassis airflow and bottlenecks.
• Define and execute thermal test plans and validation campaigns.
• Design and develop custom heat sinks and cold plates for high-power CPUs/GPUs.
• Select thermal interface materials and validate heat sink and fan designs.
• Produce thermal reports and contribute to manufacturing-viable concepts.

Skills

Thermal design

Thermal validation

CFD simulations

Thermal testing

Heat sink design

TIM selection

Troubleshooting cooling

Education

Master's degree in Mechanical Engineering

Bachelor's degree in Mechanical Engineering

Tools

CFD software

Thermal simulation tools

Job description

AMD designs high-performance computing hardware and is seeking a skilled engineer to advance thermal solutions for rack mount servers. You will lead the thermal design, validation, and performance optimization using data-driven methods and simulations.

Ideal candidates have a Master’s in a related field and several years’ experience in HPC cooling, heat sink design, and TIM selection, with a focus on manufacturability and reliability.