Thermal Engineer (HH)

Foxconn Industrial Internet - FII; Houston (TX); On-site; USD 90,000 - 120,000; Full time

Job summary

Foxconn Industrial Internet - FII is seeking a Thermal Engineer to join their Server R&D Team in Houston, Texas. The ideal candidate will have extensive experience in thermal management design for server and rack products, including strong analytical and problem-solving skills. Responsibilities include leading design efforts, conducting simulations with tools like FloTherm, and working closely with teams across the globe. A Bachelor's or Master's degree in a relevant field, along with 5+ years of industry experience, is essential. Knowledge of cooling technologies and experience with environmental testing are significant assets.

Qualifications

• 5+ years of experience in thermal design for servers and racks, familiarity with cloud computing and data center requirements.
• Deep understanding of thermodynamics, heat transfer, and fluid dynamics.
• Hands-on experience with server thermal testing equipment.

Responsibilities

• Lead thermal management design for server systems.
• Conduct thermal simulations and optimizations.
• Collaborate with cross-functional teams on thermal design.

Skills

Thermal management design

Thermodynamics

Fluid dynamics

Analytical skills

Problem-solving

Communication skills

Collaboration

Education

Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, or Aerospace Engineering

Ph.D. (preferred)

Tools

FloTherm

Icepak

Ansys CFD

PTC Creo

SolidWorks

UG NX

Environmental testing equipment

Job description

Position: Thermal Engineer – Server R&D Team

We are seeking a highly skilled Thermal Engineer specializing in thermal management design for server and rack products. This role involves developing thermal solutions from concept to mass production, utilizing advanced simulation and testing techniques to ensure product performance and reliability.

Key Responsibilities:

• Lead thermal management design for server and rack systems, including chip, board, system, and rack-level thermal solutions.
• Conduct thermal simulation and optimization using advanced tools such as FloTherm, Icepak, and Ansys CFD.
• Plan and execute thermal tests, including operating environmental chambers to validate design performance and reliability.
• Analyze and optimize airflow management systems and design efficient cooling solutions, such as liquid cooling or hybrid cooling technologies.
• Collaborate with cross-functional teams (mechanical design, electrical design, and manufacturing) and customers to ensure designs meet thermal performance, production requirements, and client-specific needs.
• Actively participate in customer technical review meetings, provide design recommendations, and resolve technical issues promptly.
• Build strong client relationships by working closely with customers to refine technical solutions and ensure alignment with their expectations.
• Review and evaluate new technologies and materials to ensure thermal design meets industry trends and future needs.
• Prepare detailed test reports and technical documentation to support internal and customer design reviews.
• Work closely with Taipei and other global R&D centers, requiring strong communication skills in English and Mandarin.

Qualifications:

• Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Engineering, or Aerospace Engineering. A Ph.D. is a plus.
• At least 5 years of experience in thermal design for servers and racks, with familiarity with cloud computing and data center requirements.
• Deep understanding of thermodynamics, heat transfer, and fluid dynamics, with practical application in design and testing.
• Expertise in thermal simulation tools (e.g., FloTherm, Icepak, Ansys CFD) and 3D/2D CAD tools (e.g., PTC Creo, SolidWorks, UG NX).
• Hands‑on experience with server thermal testing equipment, including environmental chambers and airflow measurement devices.
• Ability to develop and optimize liquid cooling solutions and a strong understanding of hybrid cooling technologies.
• Familiarity with fan module design and airflow control techniques.
• Excellent analytical and problem‑solving skills, with the ability to perform trade‑off analysis and evaluate multiple design options efficiently.
• Strong cross‑functional and customer communication skills, with fluency in English required; Mandarin proficiency preferred.
• Familiarity with Product Data Management (PDM) systems such as Windchill and experience with Agile Development processes.

Additional Advantages:

• Familiarity with rack server design specifications and data center operational requirements.
• Experience in developing products for hyperscale data centers is highly desirable.
• Deep knowledge of industry thermal standards, such as ASHRAE TC 9.9, and the ability to apply them in product design.