Are you ready to elevate PCBA manufacturing at global scale?Do you enjoy tackling complex SMT and post‑SMT challenges, building standards others adopt, and turning new equipment into sustained performance? At Rockwell Automation, our Manufacturing Process Engineering – PCBA team is seeking an experienced engineer to optimize electronic assembly across our global operations. You will report to the Manager of Manufacturing Process Engineering – PCBA and spend substantial time on site at our Mequon and New Berlin locations.Your impactLead with expertise in at least two areas: Wave soldering, Selective soldering, Conformal coating, PCB panel singulation, SMT solder printing, SMT pick‑and‑place, SMT reflow, AOI, and equipment maintenance & troubleshooting.Codify excellence: write and roll out global standards, procedures, work instructions, and training that reduce cost, improve quality, and increase throughput.Own capital execution: specify, justify, purchase, install, and release production equipment; benchmark new technologies; evaluate facilities using standardized criteria.Back decisions with data: design DOE, apply control charts and statistical analysis, monitor/report KPIs, and drive DMAIC/DMADV projects.Engineer for manufacturability: partner with design teams on DFM/DFA; embed assembly requirements into Electronic Assembly Design Guidelines; present findings and lead technical reviews.What drives usOur mission is to enhance quality, reliability, throughput, and long‑term profitability through global standardization, strategic capital deployment, and technology innovation. We operate at the intersection of manufacturing excellence, technology roadmap ownership, process standardization, and advanced process analysis.Minimum qualificationsBachelor's degree in a relevant field.Comfort working hands‑on in Mequon and New Berlin while collaborating globally.Legal authorization to work in the U.S. We will not sponsor individuals for employment visas, now or in the future, for this job openingPreferred profileApproximately 8+ years of experience.BS or MS in Mechanical, Electrical, or Industrial Engineering.7–10+ years of hands‑on experience in electronic assembly manufacturing.Strength in solder profiling, SMT, post‑SMT, or conformal coating.IPC‑A‑610 familiarity.Lean Six Sigma experience (Green Belt or higher preferred).Skills and frameworksBachelor's Degree5 Why (Root Cause Analysis Method)ISO 22000Process EngineeringDesign for Assembly (DFA)Electrical / Electronic SystemsEngineering DegreeAS9100 ExperienceIf you’re energized by scaling best practices, leveraging data to unlock throughput, and guiding capital investments that move the needle, we’d like to meet you.