Sr. Process Engineer

XLR8 EMS; San Diego (CA); On-site; USD 110,000 - 160,000; Full time

Benefits offered by this job

401(k)

401 (k) matching

Dental insurance

Health insurance

Vision insurance

Paid time off

Job summary

XLR8 EMS seeks a highly skilled Manufacture Process Engineer to lead and optimize PCBA manufacturing. You will design stencil designs, develop reflow and wave soldering profiles, apply conformal coating, and oversee secondary operations to ensure high quality and cost efficiency.

In this hands-on role, you will collaborate with design and quality teams, drive yield improvements, and implement CAPA to strengthen process robustness while maintaining IPC‑A‑610 and J‑STD‑001 standards in a

Qualifications

• Bachelor’s degree in engineering or related field; Master’s preferred.
• 7–10 years in PCBA manufacturing engineering with hands‑on expertise.
• Deep knowledge of stencil design, solder paste, reflow/ vapor phase, wave soldering, and conformal coating.

Responsibilities

• Design, validate, and optimize stencil designs for solder paste application.
• Develop and maintain reflow profiles, including vapor phase reflow.
• Establish and refine wave soldering profiles for through‑hole components.
• Define secondary operations and oversee conformal coating processes.
• Lead CAPA, yield improvements, and NPI support with cross‑functional teams.

Skills

Stencil design

Reflow soldering

Wave soldering

Conformal coating

CAPA methodologies

NPI process development

SMT equipment

DFM/DFT

Lean Six Sigma

Project management

IPC standards

Education

Bachelor's degree

Master's preferred

Tools

CAD tools

AOI/X-ray

Process monitoring tools

Soldering equipment

Job description

We are seeking a highly skilled Manufacture Process Engineer to lead and optimize manufacturing processes for Printed Circuit Board Assemblies (PCBA). This role is critical in ensuring high-quality, reliable, and cost-effective production through expertise in stencil design, soldering processes, wave solder profiling, conformal coating, and secondary operations. The ideal candidate will bring deep technical knowledge, hands‑on experience, and a continuous improvement mindset to advance our PCBA manufacturing capabilities.

Key Responsibilities

• Process Development & Optimization
  • Design, validate, and optimize stencil designs for solder paste application.
  • Develop and maintain reflow soldering profiles, including vapor phase reflow processes, to ensure robust solder joints and minimize defects.
  • Establish and refine wave soldering profiles for through‑hole components.
  • Define and implement secondary operations including press‑fit connector installation, heat sink attachment, and mechanical assembly steps.
  • Develop and oversee conformal coating processes to ensure environmental protection and product reliability.
  • Create and enforce rework standards for soldering, ensuring compliance with IPC and industry best practices.
• Manufacturing Support
  • Provide technical leadership to production teams in troubleshooting assembly issues.
  • Collaborate with design engineering to ensure manufacturability of PCB layouts and component selection.
  • Drive yield improvement initiatives and root cause analysis for process‑related defects.
  • Lead Corrective and Preventive Action (CAPA) initiatives to eliminate recurring issues and strengthen process robustness.
  • Support new product introduction (NPI) by developing scalable and repeatable assembly processes.
• Quality & Compliance
  • Ensure adherence to IPC‑A‑610, J‑STD‑001, IPC‑7711/7721, and other relevant industry standards.
  • Maintain documentation of process parameters, work instructions, and control plans.
  • Partner with quality engineering to implement corrective and preventive actions (CAPA).
• Continuous Improvement
  • Lead projects focused on automation, efficiency, and cost reduction.
  • Evaluate and introduce new technologies, equipment, and materials to enhance PCBA processes.
  • Train and mentor junior engineers and technicians in advanced assembly techniques.

Qualifications & Experience

• Education: Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field. Master’s preferred.
• Experience: Minimum 7–10 years in PCBA manufacturing engineering, with proven expertise in:
  • Stencil design and solder paste application.
  • Reflow soldering (including vapor phase reflow) and thermal profiling.
  • Wave soldering process development and optimization.
  • Conformal coating application and process control.
  • Secondary operations (press‑fit connectors, heat sinks, mechanical assembly).
  • Rework and repair standards for solder joints.
  • Root cause analysis and CAPA methodologies for troubleshooting and issue resolution.
• Strong knowledge of IPC standards (IPC‑A‑610, J‑STD‑001, IPC‑7711/7721).
• Hands‑on experience with SMT equipment, AOI/X‑ray inspection, and process monitoring tools.
• Demonstrated success in NPI process development and scaling to volume production.
• Excellent problem‑solving, analytical, and communication skills.
• Ability to lead cross‑functional teams and drive process improvements in a fast‑paced environment.

Preferred Skills

• Experience with Design for Manufacturability (DFM) and Design for Test (DFT) principles.
• Familiarity with Lean Manufacturing and Six Sigma methodologies.
• Proficiency in CAD tools for stencil and fixture design.
• Knowledge of advanced soldering techniques (selective soldering, laser soldering).
• Strong project management and leadership capabilities.

Benefits

• 401(k)
• 401 (k) matching
• Dental insurance
• Health insurance
• Vision insurance
• Paid time off