ATD MIHL Equipment Development Engineer

Intel Corporation; Phoenix, Northern (AZ, KY); Hybrid; USD 115,000 - 163,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Benefits package

Job summary

Intel Corporation's Packaging Module Development team is seeking a Packaging Module Development Engineer to design and optimize processes and equipment that support Intel's roadmap for next‑generation packaging solutions.

You will contribute to manufacturing efficiency, product reliability, and technology advancement by applying DOE, SPC, and design for manufacturability across packaging platforms.

Qualifications

• Bachelor's degree in Mechanical Eng, Materials Science, Metallurgical Eng, or related STEM with 3+ years of experience.
• Master's degree with 2+ years of relevant experience.
• PhD with 6+ months of relevant experience.
• Proficiency in SPC and DOE principles.
• Familiarity with mechanical drawings and GD&T.
• Competency in SolidWorks or AutoCAD.

Responsibilities

• Develop and refine packaging processes and equipment to achieve targets.
• Apply DOE and SPC to optimize processes; document findings.
• Design and maintain equipment to test packaging under heat, humidity, cycles.
• Ensure manufacturability of layouts and manage manufacturing workflows.
• Define material specifications with supplier QA and procurement.
• Lead continuous improvement and provide expert consultation.

Skills

SPC & DOE

Drawings & GD&T

SolidWorks

AutoCAD

Education

Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM with 3+ years

Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM with 2+ years

PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM with 6+ month experience

Tools

SolidWorks

AutoCAD

Job description

Packaging Module Development Engineer

Join Intel's Packaging Module Development team and play a critical role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation packaging solutions. Your work will directly impact manufacturing efficiency, product reliability, and technological advancements, ensuring Intel maintains its position as a global leader in the semiconductor industry.

Business group Intel's Packaging Module Development team focuses on advancing assembly and packaging technologies that enable cutting‑edge solutions across Intel's diverse product portfolio. This group collaborates with cross‑functional teams to drive innovation in manufacturing processes, enhance product reliability, and support Intel's broader mission of delivering world‑class technologies.

Key Responsibilities of ATD Media Inspection Handling Laser Equipment Development Engineer

• Develop and refine packaging processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.
• Apply Design of Experiments (DOE) principles and statistical methodologies to optimize processes and specifications, documenting findings through technical reports.
• Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as heat, humidity, temperature cycles, and dynamic forces.
• Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.
• Define material specifications and collaborate with supplier quality and procurement teams to ensure compliance with quality and performance benchmarks.
• Innovate new techniques, tools, and quality screens to proactively identify and mitigate packaging reliability challenges.
• Set reliability benchmarks based on a thorough understanding of failure mechanisms to meet customer needs.
• Lead problem‑solving initiatives and drive continuous improvement in equipment and processes.
• Provide expert consultation to internal teams and partners on packaging challenges and technical solutions.
• Standardize product qualification practices and manufacturing quality systems while managing technical risks aligned with product milestones.

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. This position is not eligible for Intel immigration sponsorship.

• Minimum Qualifications Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience.
• -OR- Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience.
• -OR- PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 6+ month of relevant experience.
• - Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• - Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing
• - Competency in mechanical design software such as SolidWorks or AutoCAD.

Preferred Qualifications

• Proven ability to lead technical innovation and manage complex, time‑sensitive projects.
• Understanding of semiconductor fabrication processes and packaging technologies.
• Familiarity with supply chain management in a manufacturing or materials qualification environment.
• Experience with high‑precision manufacturing methods, including stamping and CNC machining.

Job Details

• Job Type: Experienced Hire
• Shift: Shift 1 (United States of America)
• Primary Location: US, Arizona, Phoenix
• Additional Locations:
• Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role This role will require an on‑site presence.

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.