Substrate Quality and Reliability Engineer

Intel; Phoenix (AZ); Hybrid; USD 104,000 - 199,000; Full time

Job summary

Intel is seeking a Substrate Quality and Reliability Engineer to drive substrate capacity expansion and influence technology decisions for Intel package and assembly. You will enable qual plans and strategies to meet milestones and assess risks at the substrate level.

The role requires onsite presence with a hybrid work option. You will interact with cross-functional teams to develop and validate testing, inspection, and reliability screens for future high-volume manufacturing.

Qualifications

• Master's degree with 2+ years of industry experience OR PhD in a related engineering discipline.
• 2+ years of experience in substrate manufacturing, semiconductor fabrication, package assembly, wafer-level processing, or board/system integration.
• Demonstrated ability to collaborate across cross-functional teams.

Responsibilities

• Develop, apply, and maintain quality and reliability standards for Substrate packaging components.
• Define inspection, screening, and testing mechanisms to mitigate yield and reliability risks.
• Develop reliability models through statistical analysis to categorize risk.
• Deliver standardization in qualification and manufacturing quality systems.
• Engage with packaging technology development and partner engineering teams to lower risks.

Education

Master's or PhD in Materials Science / Electrical Engineering / Physics / Chemistry / Mechanical Engineering / Aerospace Engineering / Chemical Engineering

Tools

Python

SQL

Statistics

Job description

Job Details

Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. As a Substrate Quality and Reliability Engineer you will drive substrate capacity expansion to influence key technology decisions for Intel package and assembly in TD and ramp phases. You will also be responsible to enable qual plans and strategies to meet product milestones and assess key risks to technology development activities at a component level and address product manufacturing challenges at substrate factories for future HVM stability. You will influence supplier process technologies and their interaction with assembly as well as substrate package induced customer facing issues and their validation. Role and Responsibilities include but are not limited to:

• Develop, apply, and maintain quality and reliability standards for Substrate packaging components for Test Vehicle and Product.


• Develop the integrated materials/process and technology targets to meet the requirements of product use case requirements and demonstrate maturity milestones.


• Define inspection, screening, and testing mechanism to mitigate yield and reliability risks.


• Determine reliability requirements to achieve reliability objectives.


• Develop reliability models by performing statistical analysis to more accurately categorize reliability risk to customer specification and field risk.


• Deliver standardization in product qualification, manufacturing quality systems, and methods.


• Influence, enable, and continuously engage with packaging technology development and partner engineering teams on process maturity to lower risks.


• Develop new acceleration techniques, analytical tools, and quality screens to ensure the early identification of potential problems with every new technology and process.


• Respond to customer requests or quality events as they occur.


• Make proactive recommendations for changes in specification or formulation to improve product quality and reliability.

The ideal candidate should exhibit the following behavioral traits:

• Influence cross-functional teams and solve complex technical challenges and deliver robust solutions.


• Thrive in ambiguous environment and competing priorities and provide technical and analytical problem solving.

Qualifications

Minimum Qualifications

• Master's degree with 2+ years of industry experience OR PhD degree in Materials Science, Electrical Engineering, Physics, Chemistry, Mechanical Engineering, Aerospace Engineering, Chemical Engineering, or a related engineering discipline.


• 2+ years of experience in at least one of the following areas: substrate manufacturing, semiconductor fabrication, package assembly, wafer-level processing, or board/system integration.


• Demonstrated ability to collaborate across cross-functional teams.

Preferred Qualifications

• 1+ years of experience in empirical data collection and statistical data analysis, reliability statistics, and design of experiments.


• Technical background in any of the below mentioned areas of substrate or semiconductor or Intel package technology with proficiency in one or more areas of manufacturing process development, material characterization, and development design validation.


• Technical understanding of capacitor, inductor, resistor passive component manufacturing process, functionality and testing procedures.


• Technical understanding of active component fabrication, functionality and testing procedures.


• Technical understanding of Intel's product certification methodology and integrated package risks with knowledge of modulators and controls.


• Technical understanding of accelerated life testing methods and reliability statistics.


• Programming or scripting experience for data analysis, such as Python or SQL.


• Ability to lead and influence cross-functional teams while effectively communicating complex concepts to diverse audiences.


• Problem solving techniques such as model based problem solving, 8D and 5 Why.

Join Intel in our mission to create world-changing technology that enriches the lives of every person on Earth. Bring your passion, expertise, and innovation to help us achieve extraordinary results together.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Arizona, Phoenix

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $103,730.00 - 198,820.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.