Strategic Biz Development Lead, Advanced Packaging & SiC

Wolfspeed

North Carolina

On-site

USD 140,000 - 220,000

Full time

14 days+

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Job summary

Wolfspeed seeks a Strategic Business Development Manager to accelerate entry and growth in advanced packaging across AI, HPC, CPO, quantum, and AR/VR. You will identify design-in opportunities, forge ecosystem partnerships, and secure long-term engagements with chipmakers, foundries, OSATs, EDA players, photonics vendors, and AR/VR device makers.

The ideal candidate combines deep packaging knowledge with a strong commercial mindset and a track record of building high-value relationships across

Qualifications

Bachelor’s degree in Electrical Engineering, Materials Science, or related field.
10+ years in BD, partnerships, or sales within advanced semiconductor packaging or the semiconductor supply chain.
Deep knowledge of 2.5D/3D packaging, CoWoS/EMIB/Foveros, TSV, RDL, and thermal management.
Proven track record securing strategic deals with global semiconductor customers.
Ability to communicate SiC’s value to both engineering and executive audiences.

Responsibilities

Identify new business opportunities for SiC in advanced packaging across AI/HPC, CPO and AR/VR.
Build executive-level partnerships with AI chip designers, foundries, OSATs, EDA vendors, and photonics suppliers.
Lead co-development programs and PDK-led engagements embedding SiC into packaging design flows.
Structure and negotiate strategic contracts and long-term supply agreements.
Align growth initiatives with SiC process capabilities and packaging requirements.
Monitor market trends and competitor roadmaps to shape strategy.