Project Manager-Advanced Packaging (Design & Processing/External Partnerships)

US01 Wolfspeed, Inc.; Durham (NC); On-site; USD 110,000 - 160,000; Full time

Job summary

Wolfspeed, Inc. is seeking a Project Manager to lead the development and implementation of advanced packaging initiatives across HPC, AI data center, and AR/VR applications.

You will manage the full lifecycle for SiC-based packaging, coordinating cross-functional and external partner teams to deliver on schedule and within budget. The ideal candidate will oversee design, processing, and external partnerships, ensuring milestones are met while balancing scope, cost, and timeline.

Qualifications

• Bachelor's degree in Electrical Engineering, Materials Science, or related field; PM cert is a plus.
• Experience managing complex technical development projects in semiconductor packaging or related hardware.
• Familiarity with 2.5D/3D architectures and AR/VR processing such as waveguide fabrication.
• Proven ability to plan budgets, schedules and resources across cross-functional teams.
• Experience coordinating with external partners such as foundries, OSATs, or research institutes on joint development or product delivery.
• Strong organizational, risk-management and problem-solving skills; ability to align multiple workstreams.
• Excellent communication and stakeholder-management across technical and business audiences.

Responsibilities

• Lead the development and implementation of advanced packaging products and process solutions across 2.5D/3D architectures.
• Organize and lead cross-functional teams spanning design, process/technology development, applications engineering, and product management.
• Plan, direct, and monitor project schedules, dependencies and milestones; identify and mitigate risks.
• Monitor budget and spending; track resource allocation to meet constraints.
• Coordinate design and processing workstreams across development and qualification phases.
• Manage interfaces with external partners—foundries, OSATs, research institutes and ecosystem players.
• Provide regular status reporting to internal leadership and external partners; escalate issues as needed.

Skills

Project management

Cross‑functional leadership

Budget management

Risk management

Stakeholder communication

External partner coordination

Scheduling & planning

Education

Bachelor's degree in Electrical Engineering or related field

Job description

We are seeking a Project Manager to lead the development and implementation of Wolfspeed's advanced packaging initiatives across high‑performance computing (HPC), AI data center, and AR/VR applications. In this role, you will manage the full project lifecycle—from initiation through delivery—for SiC‑based advanced packaging and related processing solutions, coordinating cross‑functional and external partner teams to bring new products and process capabilities to market on schedule and within budget. You will serve as the central point of coordination across design, processing, and external partnerships, ensuring that technical development and integration milestones are met while balancing scope, cost, and timeline. The ideal candidate will be located in the US.

Responsibilities

• Manage the development and implementation of advanced packaging products and process solutions across 2.5D/3D architectures—including interposers, heat spreaders/carriers, and related integration steps—coordinating activities from initiation through delivery.
• Organize and lead departmental and cross‑functional teams spanning design, process/technology development, applications engineering, and product management to deliver new packaging products and upgrade existing capabilities.
• Plan, direct, and monitor project schedules, defining milestones, dependencies, and deliverables to ensure on‑time completion; proactively identify and mitigate risks to timeline and scope.
• Monitor budget and spending against plan, track resource allocation, and drive projects to completion within defined budget constraints.
• Coordinate design and processing workstreams for advanced packaging, ensuring technical requirements are translated into executable project plans across development and qualification phases.
• Manage project interfaces with external partners—including foundries, OSATs, research institutes, and ecosystem players—coordinating joint development activities, aligning deliverables and timelines, and ensuring smooth collaboration across organizational boundaries.
• Provide clear, regular status reporting to internal leadership and external partners, escalating issues and decisions as needed to keep projects on track.

Qualifications

• Bachelor's degree in Electrical Engineering, Materials Science, or a related technical field; project management certification is a plus.
• Experience managing complex technical development projects, ideally in semiconductor packaging, advanced packaging, or a related hardware domain.
• Familiarity with advanced packaging architectures (2.5D/3D integration, interposers, chiplet integration) and/or AR/VR‑relevant processing such as waveguide fabrication and optical integration.
• Proven ability to plan and manage project schedules, budgets, and resources across cross‑functional teams.
• Experience coordinating with external partners such as foundries, OSATs, or research institutes on joint development or product delivery.
• Strong organizational, risk‑management, and problem‑solving skills, with the ability to keep multiple workstreams aligned and on schedule.
• Excellent communication and stakeholder‑management skills across both technical and business audiences.
• Ability to balance competing priorities and drive projects to completion within scope, schedule, and budget.

We are an equal opportunity employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, national origin, disability status, protected veteran status, or any other characteristic protected by law.

Wolfspeed is a powerhouse semiconductor company focused on silicon carbide and GaN technologies. After more than thirty years of forging new technology adoption and transformation, our Wolfspeed power and radio frequency (RF) semiconductors are leading the industry through unrivaled expertise and capacity.

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