Project Manager – Advanced Packaging (2.5D/3D)

Wolfspeed; Durham (NC); On-site; USD 90,000 - 140,000; Full time

Job summary

Wolfspeed in Durham, NC seeks a Project Manager to lead development and implementation of advanced packaging for HPC, AI data center, and AR/VR applications. You will manage the full lifecycle for SiC-based packaging, coordinating design, processing, and external partnerships to meet milestones, scope, and budget.

The ideal candidate holds a technical bachelor's degree (Electrical Engineering or Materials Science) with PM certification a plus, and has experience managing complex hardware

Qualifications

• Bachelor's degree in a technical field; PM certification is a plus.
• Experience managing complex technical development projects, ideally in semiconductor packaging or hardware domains.
• Experience coordinating with external partners (foundries, OSATs, institutes) on joint development.

Responsibilities

• Lead development and implementation of advanced packaging across 2.5D/3D, interposers and integration steps.
• Coordinate cross-functional teams from design, processing, and external partnerships.
• Plan milestones, dependencies, and deliverables to ensure on-time completion.
• Monitor budgets and resources, driving projects within defined constraints.
• Interface with external partners to align deliverables and timelines.

Skills

Project management

Semiconductor packaging

2.5D/3D architectures

Cross-functional leadership

Stakeholder communication

Risk management

Education

B.S. in Electrical Engineering

B.S. in Materials Science

Job description

Wolfspeed in Durham, NC seeks a Project Manager to lead development and implementation of advanced packaging for HPC, AI data center, and AR/VR applications. You will manage the full lifecycle for SiC-based packaging, coordinating design, processing, and external partnerships to meet milestones, scope, and budget.

The ideal candidate holds a technical bachelor's degree (Electrical Engineering or Materials Science) with PM certification a plus, and has experience managing complex hardware