Strategic BD Lead: Advanced Packaging & SiC for AI/HPC

US01 Wolfspeed, Inc.; Durham (NC); On-site; USD 140,000 - 190,000; Full time

Job summary

Wolfspeed, Inc. seeks a Strategic Business Development Manager to accelerate entry and growth in advanced packaging markets for SiC, across AI, HPC, CPO, quantum and AR/VR platforms.

The role focuses on identifying design‑in opportunities, forging ecosystem partnerships, and securing long‑term engagements with chipmakers, OSATs, and photonics vendors. The ideal candidate has deep packaging knowledge and a proven track record in strategic deals.

Qualifications

• Bachelor's degree in Electrical Engineering or Materials Science.
• 10+ years in business development, partnerships, or sales in advanced packaging or semiconductor supply chain.
• Strong understanding of 2.5D/3D packaging, interconnects, and thermal management in AI/HPC systems.
• Ability to communicate SiC value to engineers and executives at foundries, OSATs, and chip designers.

Responsibilities

• Identify and develop new business opportunities for SiC in advanced packaging across AI/HPC, AR/VR, and quantum markets.
• Build executive relationships with AI chip designers, foundries, OSATs, EDA players, and photonics vendors.
• Drive co-development programs and design-in engagements embedding SiC into packaging flows.
• Lead strategic contracts, licensing, and partnerships with long-term supply commitments.
• Align growth initiatives with SiC capabilities across data center, photonics, and immersive devices.
• Monitor AI hardware trends and competitor roadmaps to shape BD strategy.

Skills

Strategic partnerships

Business development

Executive relationships

Semiconductor packaging

AI/HPC market

Education

Bachelor's degree in Electrical Engineering

Bachelor's degree in Materials Science

Job description

Wolfspeed, Inc. seeks a Strategic Business Development Manager to accelerate entry and growth in advanced packaging markets for SiC, across AI, HPC, CPO, quantum and AR/VR platforms.

The role focuses on identifying design‑in opportunities, forging ecosystem partnerships, and securing long‑term engagements with chipmakers, OSATs, and photonics vendors. The ideal candidate has deep packaging knowledge and a proven track record in strategic deals.