Staff Silicon Photonics Package Design Engineer

Entrada Ventures; Goleta (CA); On-site; USD 150,000 - 190,000; Full time

Job summary

Quintessent Inc. in the San Francisco Bay Area is seeking a Staff Package Design Engineer to advance the next generation of pluggable optical interconnects for data center scale-up and scale-out products.

You will develop packages for silicon photonics and electronics components, generate internal designs, and collaborate with packaging houses to deliver and test production devices. Your work directly shapes shipped products and company capabilities.

Qualifications

• B.S. or M.S. in Electrical/Mechanical/Materials engineering.
• Experience with package designs for volume production.
• Ability to translate design to layout and work with packaging houses for implementation.
• Thermal, mechanical, SI/PI knowledge essential; multichip design using silicon interposer is a plus.
• Ability to qualify packages for volume production with data center parts, automotive parts, pluggable optics; close work with vendors/OSAT.

Responsibilities

• Develop packages for silicon photonics and electronics components.
• Generate the design internally and collaborate with packaging houses to deliver/test production devices.
• Your work directly shapes the products that ship and the capabilities the company builds.

Skills

Package design

Thermal management

Silicon interposer

Vendor coordination

Education

Bachelor's or Master's in Electrical/Mechanical/Materials engineering

Job description

Quintessent Inc. in the San Francisco Bay Area is seeking a Staff Package Design Engineer to advance the next generation of pluggable optical interconnects for data center scale-up and scale-out products.

You will develop packages for silicon photonics and electronics components, generate internal designs, and collaborate with packaging houses to deliver and test production devices. Your work directly shapes shipped products and company capabilities.