Staff Package Design Engineer

Quintessent Inc.; San Francisco (CA); On-site; USD 150,000 - 190,000; Full time

Job summary

Quintessent Inc. in San Francisco is seeking a Staff Package Design Engineer to build the next generation of pluggable optical interconnects for data center AI infrastructure.

You will serve as the technical authority developing firmware for products and lead packaging development for Silicon Photonics and electronics components. Your work will involve capturing designs from layout tools, coordinating with packaging houses and OSATs, and qualifying packages for volume production in data center

Qualifications

• B.S or M.S. in Electrical/Mechanical/Materials engineering.
• Experience with various package designs for volume production.
• Design workflow from layout tools to packaging houses for implementation.
• Thermal, mechanical, SI/PI knowledge of package design is essential.
• Experience with multichip design using silicon interposer is an asset.
• Ability to qualify packages for volume production; data center/automotive/pluggable optics qualification is an asset.
• Work closely with package vendors and OSAT.

Responsibilities

• Developing packages for Silicon Photonics and Electronics components.
• Ability to generate the design internally, and work with various packaging houses to deliver/test production devices.
• Your work will directly shape the products that ship and the capabilities the company builds.
• Be the technical authority for firmware development for products.

Skills

Thermal design

Mechanical design

SI/PI knowledge

Package design coordination

Multichip design (silicon interposer)

Education

B.S. or M.S. in Electrical/Mechanical/Materials Engineering

Job description

Build the laser platform that powers the next generation of AI infrastructure.

Quintessent is taking on some of the hardest challenges in optical connectivity – directly

attacking the foundational bottlenecks limiting the scalability and reliability of next-generation AI

and computing infrastructure. Our team has trailblazed pioneering work in quantum dot lasers

and amplifiers, heterogeneous integration, and multi-wavelength silicon photonics. We are

converging innovations in materials science, process integration, chip and system design to

build products that we believe will form a core part of AI networking systems.

We are a scrappy, high-trust team that takes ownership, stays humble, and believes in tackling

hard problems with speed, intellectual honesty, and relentless improvement. We hold ourselves

to a high bar, start from a deep understanding of our customers’ problems, and win or lose

together. If this sounds like you, and you want to build the laser and electronics platform that powers the next generation of AI infrastructure, we’d love to talk.

We are looking for a staff package design engineer to build the next generation of pluggable optical interconnects for Scale-Up and Scale-Out Data Center Interconnect Products

You will be the technical authority developing firmware for products, responsible for:

Developing packages for Silicon Photonics and Electronics components.Ability to generate the design internally, and work with various packaging houses to deliver/test production devices.

Your work will directly shape the products that ship and the capabilities the company builds.

To succeed, you will need these qualifications:

• B.S or M.S. In Electrical/Mechanical/Materials engineering.
• Experience should cover various package designs for volume productions.
• Design expertise should cover capturing the design from layout tools and working with various packaging design houses for implementation.
• Thermal, mechanical, SI/PI, knowledge of the package design is essential. Experience in working on multichip design using silicon interposer is an asset.
• Ability to qualify the package for volume production is expected, data center parts, automotive parts, pluggable optics, qualification is an asset. Ability to work very closely with package vendors and OSAT is expected.

Bonus if you’ve also:

• Signal Integrity and/or Thermal simulations experience
• Worked directly with customers or partners