Staff Package Design Engineer, Optical Interconnects for AI

Quintessent Inc.; San Francisco (CA); On-site; USD 150,000 - 190,000; Full time

Job summary

Quintessent Inc. in San Francisco is seeking a Staff Package Design Engineer to build the next generation of pluggable optical interconnects for data center AI infrastructure.

You will serve as the technical authority developing firmware for products and lead packaging development for Silicon Photonics and electronics components. Your work will involve capturing designs from layout tools, coordinating with packaging houses and OSATs, and qualifying packages for volume production in data center

Qualifications

• B.S or M.S. in Electrical/Mechanical/Materials engineering.
• Experience with various package designs for volume production.
• Design workflow from layout tools to packaging houses for implementation.
• Thermal, mechanical, SI/PI knowledge of package design is essential.
• Experience with multichip design using silicon interposer is an asset.
• Ability to qualify packages for volume production; data center/automotive/pluggable optics qualification is an asset.
• Work closely with package vendors and OSAT.

Responsibilities

• Developing packages for Silicon Photonics and Electronics components.
• Ability to generate the design internally, and work with various packaging houses to deliver/test production devices.
• Your work will directly shape the products that ship and the capabilities the company builds.
• Be the technical authority for firmware development for products.

Skills

Thermal design

Mechanical design

SI/PI knowledge

Package design coordination

Multichip design (silicon interposer)

Education

B.S. or M.S. in Electrical/Mechanical/Materials Engineering

Job description

Quintessent Inc. in San Francisco is seeking a Staff Package Design Engineer to build the next generation of pluggable optical interconnects for data center AI infrastructure.

You will serve as the technical authority developing firmware for products and lead packaging development for Silicon Photonics and electronics components. Your work will involve capturing designs from layout tools, coordinating with packaging houses and OSATs, and qualifying packages for volume production in data center