Principal Silicon Photonics Packaging & Process Engineer

Voyant-Photonics; New York (NY); On-site; USD 150,000 - 230,000; Full time

Job summary

Voyant Photonics, based in New York City, is seeking a Principal Silicon Photonic Packaging & Process Engineer to lead precision opto-mechanical assembly development and scalable production. You will work with photonics, mechanical, and test teams to turn designs into repeatable processes and partner with contract manufacturers to qualify lines, improve yields, and drive continuous improvement.

You will own package designs, drive automation and metrology to achieve sub-micron alignment and high

Qualifications

• BS or MS in Mechanical, Manufacturing, Photonics, or Electrical Engineering (or equivalent).
• 10+ years hands-on experience in semiconductor, photonics packaging, or precision opto-mechanical assembly environments.
• CAD modeling and simulation; SolidWorks preferred.
• Deep familiarity with automated alignment and die-attach systems.
• Strong understanding of adhesive dispense physics and related automation equipment.
• Proficiency with DOE methods, SPC, and Minitab (or equivalent tools).
• Experience with automation solution providers and contract manufacturers for transfer to high-volume production.

Responsibilities

• Lead development and scaling of precision opto-mechanical assembly processes.
• Translate design concepts into R&D builds and repeatable production processes.
• Partner with contract manufacturers to qualify lines and improve yields.
• Establish new package designs focused on robust, high-yield manufacturing.
• Scale complex processes from R&D to high-volume production across global sites.

Skills

Silicon photonics

Packaging design

Opto-mechanical assembly

DOE methods

Metrology & GR&R

Automation & robotics

Contract manufacturing

Cross-functional collaboration

Education

BS/MS in Mechanical, Manufacturing, Photonics, or Electrical Engineering

Tools

SolidWorks

CAD modeling

Minitab / statistical tools

Job description

Voyant Photonics, based in New York City, is seeking a Principal Silicon Photonic Packaging & Process Engineer to lead precision opto-mechanical assembly development and scalable production. You will work with photonics, mechanical, and test teams to turn designs into repeatable processes and partner with contract manufacturers to qualify lines, improve yields, and drive continuous improvement.

You will own package designs, drive automation and metrology to achieve sub-micron alignment and high