Staff Process Engineer — Advanced Packaging CMP (AI-Driven)

Micron Technology, Inc.; Boise (ID); Hybrid; USD 120,000 - 160,000; Full time

Job summary

Micron Technology, Inc. invites applications for a Staff Process Engineer in the Advanced Packaging CMP team.

You will startup, develop, and optimize CMP processes to improve product quality and reliability while reducing costs and increasing productivity. The role requires collaboration across regions, use of failure analysis and SPC/8D methods, and interaction with vendors to meet integration requirements.

Qualifications

• BS or MS with 5+ years CMP experience in semiconductors.
• Hands-on CMP equipment operation experience.
• Experience in dielectrics/metals CMP process development.
• Understanding integration/structural constraints with film deposition and upstream/downstream processes.
• Excellent oral and written communication skills.

Responsibilities

• Perform fundamental research, consumables development, and hardware evaluation.
• Initiate experiments to widen process margins and evaluate manufacturability of next-generation solutions.
• Incorporate best manufacturing methods into early development phases.
• Design and implement advanced process monitoring and control methodologies.
• Serve as technical advisor and lead multidisciplinary projects.
• Collaborate with vendors to meet integration requirements.

Skills

CMP process development

CMP equipment operation

Optical metrology

Profilometry

Data science

AI for workflows

Communication skills

Materials science background

Education

BS or MS in Materials Science / Engineering / Physics or equivalent

PhD in related field (preferred)

Tools

AMAT LKP

EBARA-300X

Optical metrology equipment

Profilometer

Polishing slurries

Polishing pads

Job description

Micron Technology, Inc. invites applications for a Staff Process Engineer in the Advanced Packaging CMP team.

You will startup, develop, and optimize CMP processes to improve product quality and reliability while reducing costs and increasing productivity. The role requires collaboration across regions, use of failure analysis and SPC/8D methods, and interaction with vendors to meet integration requirements.