Staff Semi Packaging Engineer

Analog Devices

San Jose (CA)

On-site

USD 130,000 - 188,000

Full time

14 days+

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Benefits offered by this job

Medical, Vision and Dental coverage

401k

Paid vacation

Holidays and sick time

Job summary

Analog Devices, a global semiconductor leader, seeks a Packaging Engineer in San Jose, CA to drive IC package and power module development. The role emphasizes advanced packaging platforms, collaboration with OSATs, and cross-functional teams to ensure timely delivery.

Requirements include a Master’s degree in a relevant field and 3+ years of industrial experience, with PhD preferred. Competitive compensation includes a substantial wage range and comprehensive benefits.

Qualifications

Master’s degree in a relevant engineering field with 3+ years of industrial experience.
In-depth knowledge of analog IC package and module design and manufacture.
Experience with package BOM selection and materials properties.
Familiarity with design rules for emerging package platforms.

Responsibilities

Drive development and adoption of advanced IC package platforms and processes.
Design and optimize IC packages using standard and advanced platforms.
Design and optimize power modules for performance and reliability.
Define and advance package design rules for new platforms.
Collaborate with overseas assembly subcontractors/OSATs on new packaging.
Coordinate with reliability, business units and supply chain for packaging.
Plan and drive on-time delivery of packaging development projects.

Skills

IC package design

Power module design

Thermal/mechanical analysis

Cross-functional collaboration

Education

Master’s degree in Materials Science and Engineering

Master’s degree in Applied Physics

Master’s degree in Electrical or Mechanical Engineering

PhD preferred

Tools

CAD tools

Job description

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today’s innovators stay Ahead of What’s Possible. Learn more at www.analog.comand on LinkedIn and X.

We are looking for a highly motivated Packaging Engineer who will drive IC package and power module development activities for ADI’s new and existing products. This position will be based in San Jose, CA.

Job Description

Advanced package platform development: drive the development and adoption of advanced IC package platforms and processes, such as embedded package and fan-out wafer-level package.

IC package design: design and optimize IC packages for a wide range of ADI products, using common and advanced analog IC package platforms and assembly/bumping processes.

Power module design: design and optimize power modules for performance, manufacturing, and reliability.

Package design rule: define, maintain, and advance package design rules for emerging package platforms and power modules.

Assembly subcontractor/OSAT management: work closely with ADI’s overseas assembly subcontractor/OSATs for new package development and other package-related engineering activities. Late afternoon/early evening conference calls are expected.

Cross functional team collaborations: work closely with internal reliability team, business units, and supply chain management team to provide package engineering support.

Project management: plan and drive for on time delivery of package development projects.

Minimum Qualifications

Master’s degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, or Mechanical Engineering is required with at least 3 years of industrial working experience in related fields. PhD. degree is preferred.

In-depth knowledge and experience in analog IC package and module design, optimization, and manufacturing.

Knowledge in IC package reliability requirements, failure analysis techniques, assembly process issues, etc.

Knowledge and experience in selecting IC package bill of material (BOM): solid understanding of mechanical, thermal, and electrical properties of materials, including semiconductors, metals, ceramics, and polymer composites.

Package model and drawing creation: solid skills/experience in CAD tools are desired to create package design models and drawings for package development, simulation, and documentation.

Package process development: experienced in manufacturing control plan, process failure mode and effects analysis (FMEA), process change notification (PCN), statistical process control (SPC), and design of experiment (DOE).

Package-level and system-level thermal/mechanical/electrical/magnetic simulation skill is a plus.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Experienced

Required Travel: Yes, 10% of the time

Shift Type: 1st Shift/Days

The expected wage range for a new hire into this position is $130,168 to $188,490.

Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.