Senior Engineer, Semiconductor Packaging

Analog Devices; Wilmington (MA); On-site; USD 95,600 - 131,450; Full time

Benefits offered by this job

Medical coverage

401k

Paid vacation and holidays

Job summary

Analog Devices in Wilmington, Massachusetts, is seeking an experienced engineer to focus on the development of advanced packaging solutions for semiconductor devices. Suitable candidates will develop packaging that meets performance and reliability requirements.

The role requires a PhD or Master's degree in relevant fields along with strong hands-on experience in semiconductor packaging and electrical simulation tools. Benefits include medical coverage, 401k, and a performance-based bonus.

Qualifications

• 2+ years of hands-on experience in semiconductor packaging development or manufacturing.
• Good understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
• Strong communication skills and ability to work effectively in cross-functional teams.

Responsibilities

• Drive the design and development of advanced packaging solutions.
• Perform electrical simulations of IC packages.
• Collaborate with OSAT partners to resolve technical issues.

Skills

Semiconductor packaging development

Electrical simulation tools

Cross-functional teamwork

Education

PhD or Master’s degree in a relevant field

Tools

EMPro

ADS

Cadence Allegro

Job description

Responsibilities

This role will focus on the development of advanced packaging solutions for semiconductor devices across multiple market segments. The packaging solutions must meet demanding product performance, reliability, manufacturability, and cost requirements. Candidates will be expected to:

• Drive and support the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
• Perform electrical simulations of IC packages, modules, or systems using commercial simulation tools.
• Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.
• Collaborate with OSAT partners and substrate suppliers to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
• Work with quality and reliability teams to establish reliability criteria for semiconductor products across various market applications.
• Develop and maintain package design guidelines, process specifications, and technical documentation.

Qualifications

• PhD or Master’s degree in Electrical Engineering, Mechanical Engineering, or Materials Science.
• 2+ years of hands‑on experience in semiconductor packaging development or manufacturing.
• Good understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
• Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
• Hands‑on experience with electrical simulation tools such as EMPro, ADS, Sigrity, HFSS, or similar tools.
• Familiarity with RLC extraction, signal integrity, power integrity, electromagnetic simulation, and circuit simulation.
• Experience with Cadence Allegro is a plus.
• Strong communication skills and the ability to work effectively in cross‑functional and global teams.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce – Bureau of Industry and Security and/or the U.S. Department of State – Directorate of Defense Trade Controls. As such, applicants for this position – except U.S. Citizens, U.S. Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Details

Job Req Type: Experienced

Required Travel: Yes, 10% of the time

Shift Type: 1st Shift/Days

The expected wage range for a new hire into this position is $95,600 to $131,450.

Benefits

• Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
• This position qualifies for a discretionary performance‑based bonus which is based on personal and company factors.
• This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.