Senior Engineer, Semi Packaging Engineering

1010 Analog Devices Inc.; Wilmington (MA); On-site; USD 96,000 - 131,000; Full time

Job summary

Analog Devices, Inc. in Wilmington, MA seeks a packaging development professional to drive design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, SIP, and module products.

The role involves simulations, collaboration across teams, and supplier engagement to optimize yield. Requirements include a PhD or Master’s in a relevant field and 2+ years of packaging experience, plus hands-on use of EMPro/ADS/Sigrity/HFSS.

Qualifications

• PhD or Master’s degree in Electrical, Mechanical, or Materials Science.
• 2+ years in semiconductor packaging development or manufacturing.
• Solid understanding of IC packaging materials and their mechanical, thermal, and electrical behavior.
• Knowledge of IC package structures, substrate technologies, and assembly processes.
• Hands-on with electrical simulation tools (EMPro, ADS, Sigrity, HFSS) and Cadence Allegro is a plus.

Responsibilities

• Drive and support the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, SIP, and module products.
• Perform electrical simulations of IC packages, modules, or systems using commercial tools.
• Collaborate with cross-functional teams to understand product and packaging requirements and resolve technical issues.
• Collaborate with OSAT partners and substrate suppliers to resolve issues, drive process development, and improve yield.
• Establish reliability criteria with quality and reliability teams for semiconductor products across market applications.
• Develop and maintain package design guidelines, process specifications, and technical documentation.

Skills

Semiconductor packaging

Cross-functional teamwork

Electrical simulation

Cadence Allegro

Education

PhD or Master’s degree in Electrical Engineering, Mechanical Engineering, or Materials Science

Tools

EMPro

ADS

Sigrity

HFSS

Cadence Allegro

Job description

About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. This role will focus on the development of advanced packaging solutions for semiconductor devices across multiple market segments. The packaging solutions must meet demanding product performance, reliability, manufacturability, and cost requirements. Candidates will be expected to:

Candidates will be expected to:

• Drive and support the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
• Perform electrical simulations of IC packages, modules, or systems using commercial simulation tools.
• Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.
• Collaborate with OSAT partners and substrate suppliers to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
• Work with quality and reliability teams to establish reliability criteria for semiconductor products across various market applications.
• Develop and maintain package design guidelines, process specifications, and technical documentation.

Qualifications

• PhD or Master’s degree in Electrical Engineering, Mechanical Engineering, or Materials Science.
• 2+ years of hands-on experience in semiconductor packaging development or manufacturing.
• Good understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
• Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
• Hands‑on experience with electrical simulation tools such as EMPro, ADS, Sigrity, HFSS, or similar tools.
• Familiarity with RLC extraction, signal integrity, power integrity, electromagnetic simulation, and circuit simulation.
• Experience with Cadence Allegro is a plus.
• Strong communication skills and the ability to work effectively in cross-functional and global teams.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group. EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Experienced Required Travel: Yes, 10% of the time Shift Type: 1st Shift/Days

The expected wage range for a new hire into this position is $95,600 to $131,450. Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.

This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.

This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. Come join ADI – a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories:
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