Senior Engineer, Semi Packaging Engineering

Analog Devices; Wilmington (MA); On-site; USD 96,000 - 131,000; Full time

Benefits offered by this job

Medical coverage

Dental coverage

Vision coverage

401k

Paid vacation

Holidays

Sick time

Job summary

Analog Devices, Inc. is seeking a packaging developer to lead the design, development, and qualification of advanced semiconductor packaging solutions, including wire-bond, flip-chip, and system-in-package.

You will run electrical simulations using EMPro, ADS, Sigrity, HFSS, and collaborate with cross-functional teams to resolve complex issues with OSAT partners. Candidates should have a PhD or Master’s in EE/Mech/MatSci and 2+ years of hands-on experience, with strong knowledge of materials,

Qualifications

• PhD or Master's degree as stated.
• 2+ years of hands-on packaging experience.
• Knowledge of IC packaging materials and mechanical/electrical behaviors.
• Familiarity with IC package structures and substrate technologies.

Responsibilities

• Drive design, development, and qualification of advanced packaging solutions.
• Perform electrical simulations of IC packages and modules.
• Collaborate with cross-functional teams to define requirements.
• Work with OSAT partners to resolve issues and optimize processes.
• Maintain package design guidelines and technical documentation.

Skills

Electrical simulation tools

Cross-functional teamwork

Communication skills

Problem solving

Education

PhD or MSc in Electrical/Mechanical/Materials Science

Tools

EMPro

ADS

Sigrity

HFSS

Cadence Allegro

Job description

About Analog DevicesAnalog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X .

This role will focus on the development of advanced packaging solutions for semiconductor devices across multiple market segments. The packaging solutions must meet demanding product performance, reliability, manufacturability, and cost requirements. Candidates will be expected to:

• Drive and support the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
• Perform electrical simulations of IC packages, modules, or systems using commercial simulation tools.
• Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.
• Collaborate with OSAT partners and substrate suppliers to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
• Work with quality and reliability teams to establish reliability criteria for semiconductor products across various market applications.
• Develop and maintain package design guidelines, process specifications, and technical documentation.

Qualifications

• PhD or Master's degree in Electrical Engineering, Mechanical Engineering, or Materials Science.
• 2+ years of hands-on experience in semiconductor packaging development or manufacturing.
• Good understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
• Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
• Hands-on experience with electrical simulation tools such as EMPro, ADS, Sigrity, HFSS, or similar tools.
• Familiarity with RLC extraction, signal integrity, power integrity, electromagnetic simulation, and circuit simulation.
• Experience with Cadence Allegro is a plus.
• Strong communication skills and the ability to work effectively in cross-functional and global teams.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position - except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) - may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

Job Req Type: Experienced

Required Travel: Yes, 10% of the time

Shift Type: 1st Shift/Days

The expected wage range for a new hire into this position is $95,600 to $131,450. Actual wage offered may vary depending on work location , experience, education, training, external market data, internal pay equity, or other bona fide factors.

This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.

This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time , and other benefits.