Staff Engineer, Multiphysics Packaging Simulation

Absolics, Inc.; Covington (GA); Hybrid; USD 90,000 - 150,000; Full time

Job summary

Absolics, Inc. in Covington, GA seeks a Staff Engineer to lead advanced packaging multiphysics modeling from die interconnects to system integration.

You will build, validate, and interpret predictive models for mechanical and electrical performance, guiding design decisions for processes and products. Responsibilities include finite element analysis of interlayer stresses, material characterization, and correlating simulation with reliability data to drive design rules and co-optimization

Qualifications

• PhD or equivalent industry experience in mechanical engineering, materials science, or semiconductor device physics.
• Hands-on experience with FEA-based stress, thermo-mechanical and fracture analysis in multilayer stacks.
• Ability to translate simulation results into actionable design rules for process and product teams.

Responsibilities

• Own Multiphysics simulation across advanced packaging architectures from die level interconnects through buildup layers to system-level integration.
• Build and validate predictive models for mechanical (stress, warpage, fatigue, delamination, cracking) and electrical (signal/power integrity, thermal-electrical coupling) performance.
• Translate simulation output into design rules and go/no-go decisions for process and product teams.
• Perform FEA of interlayer stresses, material characterization and constitutive modeling, and reliability-related failure mode prediction.

Skills

FEA modeling

Interface stress & delamination

Material property modeling

RDL buildup layer knowledge

Failure mode analysis

Electrical simulation basics

semiconductor packaging processes

Scripting/automation

design-rule translation

machine learning surrogate modeling

Education

PhD or equivalent industry experience

Tools

ANSYS

Abaqus

COMSOL

Job description

Absolics, Inc. in Covington, GA seeks a Staff Engineer to lead advanced packaging multiphysics modeling from die interconnects to system integration.

You will build, validate, and interpret predictive models for mechanical and electrical performance, guiding design decisions for processes and products. Responsibilities include finite element analysis of interlayer stresses, material characterization, and correlating simulation with reliability data to drive design rules and co-optimization