Lead Tech Integration Engineer, Advanced Packaging

Absolics-Inc; Covington (GA); On-site; USD 100,000 - 160,000; Full time

Benefits offered by this job

401K match

Healthcare coverage

Life, STD, LTD insurance

PTO and self-development

Lunch benefit

Job summary

Absolics Inc., located in Covington, GA, seeks a Tech Integration Engineer to lead advanced packaging substrate integration from customer requirements through qualification and ramp to mass production.

The role serves as the primary customer technical interface and aligns internal teams to meet performance, quality, reliability, schedule, and cost targets. A bachelor’s degree and 7+ years in semiconductor packaging are expected.

Qualifications

• Strong understanding of advanced packaging technologies and substrates.
• Translate customer requirements into technical specifications and plans.
• Lead customer-facing and cross-functional technical programs.
• Excellent communication and data analysis skills.

Responsibilities

• Lead advanced packaging substrate integration from customer requirements and design review through qualification, ramp, and mass production.
• Serve as the primary customer technical interface and translate requirements into internal actions.
• Maintain end-to-end understanding of substrate processes including lithography, etching, plating, inspection, and QA.
• Identify and resolve cross-process ownership and root causes in gray zones.
• Lead cross-process troubleshooting for yield, defects, reliability, and contamination.
• Coordinate teams to define ownership, containment, and corrective actions with timing.
• Establish criteria, monitor risks, and communicate status to customers and management.

Skills

Advanced packaging

Customer interface

Cross-functional leadership

Data analysis

Problem solving

Education

Bachelor's degree in Materials Science

Engineering degree

Master's degree preferred

Job description

Absolics Inc., located in Covington, GA, seeks a Tech Integration Engineer to lead advanced packaging substrate integration from customer requirements through qualification and ramp to mass production.

The role serves as the primary customer technical interface and aligns internal teams to meet performance, quality, reliability, schedule, and cost targets. A bachelor’s degree and 7+ years in semiconductor packaging are expected.