Staff Dry-Etch R&D Engineer, Advanced Packaging

Micron Technology

Boise (ID)

On-site

USD 120,000 - 170,000

Full time

11 days ago
Application generator

An application made for this job — a tailored resume and cover letter that speak straight to the posting.

Get past ATS filters

Job summary

Micron Technology is seeking a Senior or Staff Engineer for Dry Etch R&D to drive plasma-based etch processes for next-generation packaging. You will own technical programs from early research through high-volume manufacturing, working with Global R&D, suppliers, and manufacturing teams.

You will collaborate across Wet Etch, Films, Lithography, CMP, Wafer Trim, and Bonding, applying DOE and data analysis to solve complex process challenges and improve performance and variability.

Qualifications

  • Bachelor’s degree in Chemical, Mechanical, Electrical, Materials Science, Physics, Chemistry, Semiconductor Engineering, or related field.
  • Master’s or PhD with 3+ years of dry etch experience in semiconductor industry.

Responsibilities

  • Develop and optimize dry etch process modules to meet performance, yield, and reliability requirements.
  • Drive process capability, cost, and variability improvements using data-driven experimentation and equipment innovation.
  • Collaborate with process integration and adjacent process teams (Wet Etch, Films, Lithography, CMP, Wafer Trim, Bonding).
  • Perform root-cause and failure-mode analysis and work with vendors to resolve complex process and hardware challenges.
  • Support global process transfer and readiness for high-volume manufacturing, including travel.

Skills

Dry etch excellence
DOE & data analysis
R&D hands-on
Independent prioritization

Education

Bachelor's degree in related field
MS/PhD in related discipline preferred

Job description

Micron Technology is seeking a Senior or Staff Engineer for Dry Etch R&D to drive plasma-based etch processes for next-generation packaging. You will own technical programs from early research through high-volume manufacturing, working with Global R&D, suppliers, and manufacturing teams.

You will collaborate across Wet Etch, Films, Lithography, CMP, Wafer Trim, and Bonding, applying DOE and data analysis to solve complex process challenges and improve performance and variability.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Staff Engineer - Dry Etch R&D for AI Packaging
Staff Engineer - Dry Etch R&D for AI Packaging

Micron Memory Malaysia Sdn Bhd • Boise (ID)

On-site
USD 110,000 - 160,000
Senior PDK & Collateral Integration Engineer
Senior PDK & Collateral Integration Engineer

1000 Micron Technology, Inc. • Richardson (TX)

On-site
USD 140,000 - 200,000
Medical, dental and vision plans
Paid time‑off program
Paid holidays
+1
Foundry PDK & Collateral Integration Engineer
Foundry PDK & Collateral Integration Engineer

Micron Technology • Nebraska

On-site
USD 140,000 - 210,000
Intern: Plasma Dry‑Etch Equipment R&D Engineer
Intern: Plasma Dry‑Etch Equipment R&D Engineer

Micron Technology, Inc • Boise (ID)

On-site
USD 12,000 - 18,000
Medical plan
Dental plan
Vision plan
+2
Principal Dry Etch MDE Lead Engineer
Principal Dry Etch MDE Lead Engineer

Micron Technology, Inc • Boise (ID)

On-site
USD 110,000 - 170,000
Medical insurance
Dental insurance
Vision insurance
+3
STAFF ENGINEER, DRY ETCH DRAM
STAFF ENGINEER, DRY ETCH DRAM

Micron • Boise (ID)

On-site
USD 110,000 - 170,000
Medical insurance
Paid time off
Retirement plan
Dry Etch MDE Principal Lead Engineer
Dry Etch MDE Principal Lead Engineer

Micron Technology, Inc • Boise (ID)

On-site
USD 110,000 - 170,000
Medical insurance
Dental insurance
Vision insurance
+3
Dry Etch Process Development Engineer Intern
Dry Etch Process Development Engineer Intern

Micron Technology • Boise (ID)

On-site
USD 28,000 - 39,000
Dry Etch Process Engineer – AI-Enabled Semiconductor Innovation
Dry Etch Process Engineer – AI-Enabled Semiconductor Innovation

Micron • City of Albany (NY)

On-site
USD 107,000 - 182,000
Staff Engineer, Advanced Packaging: Wafer Edge Trim & Backgrind
Staff Engineer, Advanced Packaging: Wafer Edge Trim & Backgrind

Micron • Boise (ID)

On-site
USD 120,000 - 150,000